Surface modification and adhesive-free adhesion of polytetrafluoroethylene (PTFE) and silicone gel containing oleophilic SiO powder by plasma treatment.

Polytetrafluoroethylene (PTFE) has high-frequency characteristics and low transmission loss, and is expected to be used as a substrate material of printed wiring board for high-frequency applications. Meanwhile, silicone gel has superior properties such as attaching/detaching, weather resistance, and human safety. If the PTFE and silicone gel can be strongly adhered to, they can be applied to internet of things (IoT) devices that can be attached and detached freely.

Flexible selection of the functional-group ratio on a polytetrafluoroethylene (PTFE) surface using a single-gas plasma treatment.

During plasma treatment of polymers, etching occurs and functional groups are introduced on their surface. We assumed that controlling the etching rate would enable plasma treatment using a single gas to control the ratio of functional groups generated on a polymer's surface, although previous studies have indicated that several different types of functional groups are formed when the gaseous species are varied. In this study, we selected the base pressure (BP) as a parameter for controlling the etching rate and subjected polytetrafluoroethylene (PTFE) to plasma treatments using only He gas at various BPs.

Influence of air contamination during heat-assisted plasma treatment on adhesion properties of polytetrafluoroethylene (PTFE).

Plasma surface treatment is typically not effective on fluoropolymers containing polytetrafluoroethylene (PTFE). It is reported that heat-assisted plasma (HAP) treatment at high temperatures (above 200 °C) under atmospheric pressure helium (He) plasma improves the adhesion properties of PTFE. In this study, we investigated the influence of the air concentration during HAP treatment on the adhesion properties of PTFE.