Super tough and high adhesive eutectic ionogels enabled by high-density hydrogen bond network.

Ionogels have attracted tremendous interest for flexible electronics due to their excellent deformability, conductivity, and environmental stability. However, most ionogels suffer from low strength and poor toughness, which limit their practical applications. This article presents a strategy for fabricating ionogels with high toughness by constructing high-density hydrogen bonds within their microstructure.