Large-scale investigation of dry orthogonal cutting experiments Ti6Al4V and Ck45.

Unlabelled: The numerical simulation of metal cutting processes requires material data for constitutive equations, which cannot be obtained with standard material testing procedures. Instead, inverse identifications of material parameters within numerical simulation models of the cutting experiment itself are necessary. This report presents the findings from a large-scale study of dry orthogonal cutting experiments on Ti6Al4V (Grade 5) and Ck45 (AISI 1045).

Powder Surface Roughness as Proxy for Bed Density in Powder Bed Fusion of Polymers.

Powder bed fusion of polymers is becoming increasingly adopted by a variety of industries to tailor the strength, weight and functionality of end-use products. To meet the high standards of the modern manufacturing industry, parts built with powder bed fusion require consistent properties and to be free of defects, which is intrinsically connected to the quality of the powder bed prior to melting. The hypothesis of this work is that the roughness of the top surface of an unmelted powder bed can serve as a proxy for the powder bed density, which is known to correlate with final part density.

Simulation of the ductile machining mode of silicon.

Diamond wire sawing has been developed to reduce the cutting loss when cutting silicon wafers from ingots. The surface of silicon solar cells must be flawless in order to achieve the highest possible efficiency. However, the surface is damaged during sawing.

Grain flash temperatures in diamond wire sawing of silicon.

Diamond wire sawing has obtained 90% of the single-crystal silicon-based photovoltaic market, mainly for its high production efficiency, high wafer quality, and low tool wear. The diamond wire wear is strongly influenced by the temperatures in the grain-workpiece contact zone; and yet, research studies on experimental investigations and modeling are currently lacking. In this direction, a temperature model is developed for the evaluation of the flash temperatures at the grain tip with respect to the grain penetration depth.

Experimental investigation of the machining characteristics in diamond wire sawing of unidirectional CFRP.

Especially for slicing hard and brittle materials, wire sawing with electroplated diamond wires is widely used since it combines a high surface quality with a minimum kerf loss. Furthermore, it allows a high productivity by machining multiple workpieces simultaneously. During the machining operation, the wire/workpiece interaction and thus the material removal conditions with the resulting workpiece quality are determined by the material properties and the process and tool parameters.