1 results match your criteria: "Industrial Technology Research Institute. 709 Tainan[Affiliation]"
Fabrication and Performance of MEMS-Based Pressure Sensor Packages Using Patterned Ultra-Thick Photoresists.
Sensors (Basel)
September 2012
Micro-System Technology Center, Industrial Technology Research Institute. 709 Tainan, Taiwan; E-Mails: (L.T.C.); (J.S.C.); (C.Y.H.).
A novel plastic packaging of a piezoresistive pressure sensor using a patterned ultra-thick photoresist is experimentally and theoretically investigated. Two pressure sensor packages of the sacrifice-replacement and dam-ring type were used in this study. The characteristics of the packaged pressure sensors were investigated by using a finite-element (FE) model and experimental measurements.
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