17 results match your criteria: "Fraunhofer Institute for Reliability and Microintegration[Affiliation]"
Small
January 2025
Department of Microelectronics, Faculty of Electrical Engineering, Mathematics and Computer Science, Delft University of Technology, Delft, 2628 CN, The Netherlands.
Miniaturization of next-generation active neural implants requires novel micro-packaging solutions that can maintain their long-term coating performance in the body. This work presents two thin-film coatings and evaluates their biostability and in vivo performance over a 7-month animal study. To evaluate the coatings on representative surfaces, two silicon microchips with different surface microtopography are used.
View Article and Find Full Text PDFNat Commun
January 2025
Department of Microelectronics, Faculty of Electrical Engineering, Mathematics and Computer Science, Delft University of Technology, Delft, The Netherlands.
Silicon integrated circuits (ICs) are central to the next-generation miniature active neural implants, whether packaged in soft polymers for flexible bioelectronics or implanted as bare die for neural probes. These emerging applications bring the IC closer to the corrosive body environment, raising reliability concerns, particularly for chronic use. Here, we evaluate the inherent hermeticity of bare die ICs, and examine the potential of polydimethylsiloxane (PDMS), a moisture-permeable elastomer, as a standalone encapsulation material.
View Article and Find Full Text PDFNanomaterials (Basel)
January 2024
deepXscan GmbH, Zeppelinstr. 1, 01324 Dresden, Germany.
High-resolution imaging of buried metal interconnect structures in advanced microelectronic products with full-field X-ray microscopy is demonstrated in the hard X-ray regime, i.e., at photon energies > 10 keV.
View Article and Find Full Text PDFMicromachines (Basel)
June 2023
Center for Microtechnologies (ZfM), Technical University of Chemnitz, 09126 Chemnitz, Germany.
Cu-Cu direct interconnects are highly desirable for the microelectronic industry as they allow for significant reductions in the size and spacing of microcontacts. The main challenge associated with using Cu is its tendency to rapidly oxidize in air. This research paper describes a method of Cu passivation using a self-assembled monolayer (SAM) to protect the surface against oxidation.
View Article and Find Full Text PDFBioelectron Med
January 2022
Department of Microelectronics, Delft University of Technology, Delft, Netherlands.
Background: Microelectrode arrays (MEA) enable the measurement and stimulation of the electrical activity of cultured cells. The integration of other neuromodulation methods will significantly enhance the application range of MEAs to study their effects on neurons. A neuromodulation method that is recently gaining more attention is focused ultrasound neuromodulation (FUS), which has the potential to treat neurological disorders reversibly and precisely.
View Article and Find Full Text PDFMicromachines (Basel)
November 2021
Department of Microsystem Technology, University of Applied Sciences Berlin, 12459 Berlin, Germany.
Safety is a crucial issue in hydrogen energy applications due to the unique properties of hydrogen. Accordingly, a suitable hydrogen sensor for leakage detection must have at least high sensitivity and selectivity, rapid response/recovery, low power consumption and stable functionality, which requires further improvements on the available hydrogen sensors. In recent years, the mature development of nanomaterials engineering technologies, which facilitate the synthesis and modification of various materials, has opened up many possibilities for improving hydrogen sensing performance.
View Article and Find Full Text PDFWaste Manag
May 2021
KU Leuven, Departement of Mechanical Engineering, Celestijnenlaan 300A Box 2422, 3001 Leuven, Belgium; Flanders Make, Gaston Geenslaan 8, 3001 Heverlee, Belgium.
The complex composition of waste electrical and electronic equipment (WEEE) plastics represents a challenge during post-consumption plastic recycling. A single WEEE category, e.g.
View Article and Find Full Text PDFJ Clean Prod
March 2021
Fraunhofer Institute for Reliability and Microintegration IZM, Dpt. Environmental and Reliability Engineering, Gustav-Meyer-Allee 25, 13355, Berlin, Germany.
Smartphones are available on the market with a variety of design characteristics and purchase prices. Recent trends show that their replacement cycle has become on average shorter than two years, which comes with environmental impacts that could be mitigated through a prolonged use of such devices. This paper analyses limiting states and design trends affecting the durability of smartphones, and identifies reliability and repairability measures to extend the product lifetime.
View Article and Find Full Text PDFMicromachines (Basel)
April 2020
University of Applied Sciences Berlin, Wilhelminenhofstr. 75A, 12459 Berlin, Germany.
A novel capacitive sensor for measuring the water-level and monitoring the water quality has been developed in this work by using an enhanced screen printing technology. A commonly used environment-friendly conductive polymer poly(3,4-ethylenedioxythiophene):poly (styrenesulfonate) (PEDOT:PSS) for conductive sensors has a limited conductivity due to its high sheet resistance. A physical treatment performed during the printing process has reduced the sheet resistance of printed PEDOT:PSS on polyethylenterephthalat (PET) substrate from 264.
View Article and Find Full Text PDFMicromachines (Basel)
May 2019
Forschungsschwerpunkt Technologien der Mikroperipherik, Technical University Berlin, 13355 Berlin, Germany.
Fan-out wafer level packaging (FOWLP) is one of the latest packaging trends in microelectronics. Besides technology developments towards heterogeneous integration, including multiple die packaging, passive component integration in packages and redistribution layers or package-on-package approaches, larger substrate formats are also targeted. Manufacturing is currently done on a wafer level of up to 12"/300 mm and 330 mm respectively.
View Article and Find Full Text PDFMicromachines (Basel)
April 2019
Hochschule für Technik und Wirtschaft Berlin, University of Applied Sciences, Treskowallee 8, 10318 Berlin, Germany.
Micro-Electro-Mechanical Systems (MEMS) devices are widely used for motion, pressure, light, and ultrasound sensing applications [...
View Article and Find Full Text PDFSensors (Basel)
December 2018
Fraunhofer Institute for Reliability and Microintegration, Gustav-Meyer-Allee 25, 13355 Berlin, Germany.
Whispering gallery mode (WGM) glass bottle microresonators are potential highly sensitive structures for a variety of physical and bio-chemical sensing applications. In this paper, we experimentally demonstrate the practical use of glass bottle resonators as temperature sensors. The basic parameters, such as WGM resonance wavelengths, free spectral ranges, and factors, have been investigated by coupling light from a tapered fiber to the bottle structure.
View Article and Find Full Text PDFMicromachines (Basel)
May 2018
Wafer Level System Integration, Fraunhofer Institute for Reliability and Microintegration, Gustav-Meyer-Allee 25, 13355 Berlin, Germany.
In this paper, we present our work developing a family of silicon-on-insulator (SOI)⁻based high-g micro-electro-mechanical systems (MEMS) piezoresistive sensors for measurement of accelerations up to 60,000 g. This paper presents the design, simulation, and manufacturing stages. The high-acceleration sensor is realized with one double-clamped beam carrying one transversal and one longitudinal piezoresistor on each end of the beam.
View Article and Find Full Text PDFBioelectron Med
June 2018
1Section Bioelectronics, Department of Electrical Engineering, Mathematics and Computer Science, Delft University of Technology, Delft, The Netherlands.
Patients suffering from conditions such as paralysis, diabetes or rheumatoid arthritis could in the future be treated in a personalised manner using bioelectronic medicines (BEms) (Nat Rev Drug Discov 13:399-400, 2013, Proc Natl Acad Sci USA 113:8284-9, 2016, J Intern Med 282:37-45, 2017). To deliver this personalised therapy based on electricity, BEms need to target various sites in the human body and operate in a closed-loop manner. The specific conditions and anatomy of the targeted sites pose unique challenges in the development of BEms.
View Article and Find Full Text PDFMeat Sci
May 2016
Leibniz Institute for Agricultural Engineering Potsdam, Quality and Safety of Food and Feed, Max-Eyth-Allee 100, 14469 Potsdam, Germany. Electronic address:
A non-destructive mobile system for meat quality monitoring was developed and investigated for the possible application along the whole production chain of fresh meat. Pork and lamb meat was stored at 5 °C for up to 20 days post mortem and measured with a fluorescence spectrometer. Additionally, the bacterial influence on the fluorescence signals was evaluated by different experimental procedures.
View Article and Find Full Text PDFScientificWorldJournal
January 2015
Fraunhofer Institute for Reliability and Microintegration, Gustav-Meyer-Allee 25, 13355 Berlin, Germany.
Biosens Bioelectron
February 2007
Fraunhofer Institute for Reliability and Microintegration (IZM), Hansastr. 27d, D-80686 Munich, Germany.
The automated 10-channel capillary chip immunodetector (10K-IDWG) is a prototype, which has been developed for automatically operated biological agents (BA) point detection. The current technology uses a chemiluminescence capillary immunoassay (EIA) technique in combination with integrated microfluidics and allows the highly sensitive and rapid detection and preliminary identification of multiple BA in aqueous solutions in the laboratory. The chemiluminescence capillary EIA are performed within a disposable capillary chip containing 10 fused-silica capillaries arranged in parallel coated with selected capture antibodies.
View Article and Find Full Text PDF