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Contactless ultrasound spectroscopy for testing state-of-charge and integrity in lithium-ion batteries.
iScience
October 2024
Ultrasonic and Sensors Technologies Department (ITEFI), Spanish National Research Council (CSIC), 28006 Madrid, Spain.
Lithium-ion batteries (LIBs) are playing nowadays a key role in the decarbonization of the economy. However, safety issues and the lack of an accurate performance predictor after manufacturing led to the application of non-destructive methods in this field that can assess their condition. Contact ultrasounds have been successfully applied in recent years in this regard, mainly in research facilities, proving the potential of ultrasonic waves to collect meaningful information.
View Article and Find Full Text PDFNondestructive Testing of 3D Printed Fiber-Reinforced Polymeric Composites: An Experimental Critical Comparison.
3D Print Addit Manuf
June 2024
UNIDEMI, Department of Mechanical and Industrial Engineering, NOVA School of Science and Technology, Universidade Nova de Lisboa, Caparica, Portugal.
Polymer matrix composite (PMC) materials produced by additive manufacturing are a promising solution with several applications in industry. The presence of defects due to fabrication could undermine the performance of the component structure. PMC performance has been extensively studied using destructive tests, but reliable nondestructive testing (NDT) techniques are essential.
View Article and Find Full Text PDFTerahertz conductivity mapping of thin films on smart textiles.
Sci Rep
September 2024
Department of Physics and Material Sciences Center, Philipps-Universität Marburg, Renthof 5, 35032, Marburg, Germany.
Smart textiles that promise to become sensors and actuators for multiple applications are an active area of research. Conductive textiles formed by coating a fabric with a conductive film will play a key role in such applications. Here we present contactless mapping of the terahertz (THz) conductivity of thin conductive films deposited on textiles.
View Article and Find Full Text PDFRapid Detection of Cleanliness on Direct Bonded Copper Substrate by Using UV Hyperspectral Imaging.
Sensors (Basel)
July 2024
Center of Process Analysis and Technology (PA&T), School of Life Sciences, Reutlingen University, Alteburgstraße 150, 72762 Reutlingen, Germany.
In the manufacturing process of electrical devices, ensuring the cleanliness of technical surfaces, such as direct bonded copper substrates, is crucial. An in-line monitoring system for quality checking must provide sufficiently resolved lateral data in a short time. UV hyperspectral imaging is a promising in-line method for rapid, contactless, and large-scale detection of contamination; thus, UV hyperspectral imaging (225-400 nm) was utilized to characterize the cleanliness of direct bonded copper in a non-destructive way.
View Article and Find Full Text PDFElectronic Properties of Group-III Nitride Semiconductors and Device Structures Probed by THz Optical Hall Effect.
Materials (Basel)
July 2024
Center for III-Nitride Technology (C3NiT-Janzén), Linköping University, 581 83 Linköping, Sweden.
Group-III nitrides have transformed solid-state lighting and are strategically positioned to revolutionize high-power and high-frequency electronics. To drive this development forward, a deep understanding of fundamental material properties, such as charge carrier behavior, is essential and can also unveil new and unforeseen applications. This underscores the necessity for novel characterization tools to study group-III nitride materials and devices.
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