In this study, the microstructure and corrosion behavior of gas tungsten arc (GTA) welds of borated stainless steel (BSS) with a boron content of 1.62 wt.% were investigated using various filler metals. The filler metals used in this study were 308L, 309L, and 310 without the B component. A small amount of the B component was observed in the weld metal (WM) of all specimens, even though none of the filler wires contained boron. This result was caused by the dilution of the B component from the BM into the WM by the welding heat. The segregation of boron in the WM resulted in Cr-depleted areas, which negatively affected the corrosion resistance of the welded specimens. The corrosion resistance of 308L WM with the highest fraction of B components was the most deteriorated, whereas 309L WM with the lowest boron content exhibited the best corrosion resistance. Using a filler metal without the B component is expected to effectively improve the weldability and corrosion resistance of BSS; however, it can also reduce the neutron absorption capacity. Therefore, for BSS to be used as a spent nuclear fuel storage container material, the boron content of the filler metal must be carefully considered. This study provides a foundation for research aimed at improving the development and applicability of filler metals in borated stainless steel and makes it competitive for application in fourth-generation nuclear power systems.
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http://dx.doi.org/10.3390/ma18030550 | DOI Listing |
Food Res Int
April 2025
College of Food Science and Engineering, Northwest A&F University, Yangling 712100, Shaanxi, China. Electronic address:
The traditional contact release active packaging film is easily restricted by the strict storage environment and designing a more intelligent release system to achieve lasting food preservation is still a challenge. Herein, a light-responsive thermal-controlled curcumin release packaging film was fabricated by integrating chitosan with Cu-MoO and curcumin (CS/CMC). The addition of filler did not destroy the crystal structure and thermal stability of the chitosan matrix.
View Article and Find Full Text PDFInt J Biol Macromol
March 2025
Department of Сhemistry, Faculty of Natural Sciences and Geography, Abai Kazakh National Pedagogical University, 13 Dostyk Ave., Almaty 050010, Kazakhstan.
Interface packaging materials with both electromagnetic wave absorption and high thermal conductivity remains a research hotspot in modern electronics industry and aerospace field. In this paper, the cobalt alginate aerogel derived from biomass sodium alginate was carbothermal reduced to obtain a three-dimensional skeleton structure composed of zero-dimensional Co metal particles, one-dimensional silicon carbide (SiC) whiskers and biomass derived carbon (C). The dielectric-electromagnetic effect of the filler network makes the obtained polydimethylsiloxane (PDMS) based composite (PDMS/SiC@Co-C) exhibits good electromagnetic wave absorption performance, with the lowest reflection loss (RL) value can reach -40.
View Article and Find Full Text PDFMicromachines (Basel)
February 2025
Key Laboratory of Functional Materials and Applications of Fujian Province, School of Material Science and Engineering, Xiamen University of Technology, Xiamen 361024, China.
The thermal through-silicon-via (TTSV) has a serious thermal stress problem due to the mismatch of the coefficient of thermal expansion between the Si substrate and filler metal. At present, the thermal stress characteristics and strain mechanism of TTSV are mainly concerned with increases in temperature, and its temperature range is concentrated between 173 and 573 K. By employing finite element analysis and a device simulation method based on temperature-dependent material properties, the impact of TTSV thermal stress on metal-oxide-semiconductor field-effect transistor (MOSFET) properties is investigated under cooling down from room temperature to the ultra-low temperature (20 mK), where the magnitude of thermal stress in TTSV is closely associated with the TTSV diameter and results in significant tension near the Cu-Si interface and consequently increasing the likelihood of delamination and cracking.
View Article and Find Full Text PDFSoft Matter
March 2025
Dept. of Chemical Engineering, Imperial College London, South Kensington, SW7-2AZ, London, UK.
This study explores the use of squid pen protein to enhance the chemical stability and heavy metal ion (Cu and Zn) affinity of β-chitosan. Hydrogel beads with enhanced porosity and scalability were prepared using 1-butyl-3-methylimidazolium acetate, ([BMIM][OAc]), which simultaneously functionalized β-chitosan by decreasing its crystallinity and enhancing binding site access, as indicated by Fourier transform infrared (FT-IR) spectroscopy, which revealed intensification of functional group expression. Notably, this functionalization compensated for the effects of glutaraldehyde crosslinking.
View Article and Find Full Text PDFCarbohydr Polym
May 2025
Faculty of Chemical Engineering, Kunming University of Science and Technology, Kunming 650500, China. Electronic address:
The escalating environmental concerns associated with plastic waste have driven the need for sustainable food packaging solutions. In this study, a multifunctional composite film was developed to simultaneously monitor and preserve pork freshness. The film was based on loquat seed starch (LSS) as the matrix, pectin (P) and cobalt-based metal-organic framework (ZIF-67)-loaded microcrystalline cellulose (ZIF-67@MCC) as strengthening and colorimetric fillers.
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