Immersion Phase-Change Liquid Cooling Devices Based on Copper Microgroove/Nanocone Composite Structure.

Along with the rapid development of the digital economy and artificial intelligence, heat sinks available for immersion phase-change liquid cooling (IPCLC) of chips are facing huge challenges. Here, we design a high-performance IPCLC heat sink based on a copper microgroove/nanocone (MGNC) composite structure. Maximal heat fluxes () of the MGNC structure, microgroove structure, and flat copper reach 112.7, 88.0, and 24.0 W·cm as the surface temperature () of the simulated chip heat source rises up to 85 °C, respectively. As compared to the flat copper, the nanocone structure shows much higher cooling efficacy but lower cooling capacity, with = 19.8 W·cm at = 69.8 °C. Structure-performance relationships are rationalized by combined experiments and theoretical analyses. This work not only helps deeply understand the respective roles of microscale and/or nanoscale structures in IPCLC but also provides the state-of-the-art solution with the best IPCLC performance as compared to all peers' reports.