Overheating remains a major barrier to chip miniaturization, leading to device malfunction. Addressing the urgent need for thermal management promotes the development of solid-state electrocaloric cooling. However, enhancing passive heat dissipation through two-dimensional materials in electrocaloric polymers typically compromises the electrocaloric effect. In this work, we utilize two-dimensional polyamide with porous structure and hydrogen bonding to achieve multiple polar conformations with short-range order in the electrocaloric composite polymers. The structure minimizes intermolecular interactions while reducing energy barriers for field-driven polar-nonpolar conformational transitions. The electrocaloric polymer exhibits doubled cooling efficiency at electric fields as low as 40 MV m. Additionally, the electrode design achieves a vertical deformation of 2 millimeters, demonstrating the feasibility of self-driven electric refrigeration devices. This porous organic two-dimensional material resolves cooling efficiency limitations from spatial confinement, advancing the integration of two-dimensional materials in flexible electronics.
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http://dx.doi.org/10.1038/s41467-024-55726-5 | DOI Listing |
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