Quantum technology exploits fragile quantum electronic phenomena whose energy scales demand ultra-low electron temperature operation. The lack of electron-phonon coupling at cryogenic temperatures makes cooling the electrons down to a few tens of millikelvin a non-trivial task, requiring extensive efforts on thermalization and filtering high-frequency noise. Existing techniques employ bulky and heavy cryogenic metal-powder filters, which prove ineffective at sub-GHz frequency regimes and unsuitable for high-density quantum circuits such as spin qubits. In this work, we realize ultra-compact and lightweight on-chip cryogenic filters based on the attenuation characteristics of finite ground-plane coplanar waveguides. These filters are made of aluminum on sapphire substrates using standard microfabrication techniques. The attenuation characteristics are measured down to a temperature of 500 mK in a dilution refrigerator in a wide frequency range of a few hundred kHz to 8.5 GHz. We find their performance is superior by many orders compared to the existing filtering schemes, especially in the sub-GHz regime, negating the use of any lumped-element low-pass filters. The compact and scalable nature makes these filters a suitable choice for high-density quantum circuits such as quantum processors based on quantum dot spin qubits.
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http://dx.doi.org/10.1063/5.0243614 | DOI Listing |
Rev Sci Instrum
January 2025
Indian Institute of Science Education and Research, Thiruvananthapuram, Kerala 695551, India.
Quantum technology exploits fragile quantum electronic phenomena whose energy scales demand ultra-low electron temperature operation. The lack of electron-phonon coupling at cryogenic temperatures makes cooling the electrons down to a few tens of millikelvin a non-trivial task, requiring extensive efforts on thermalization and filtering high-frequency noise. Existing techniques employ bulky and heavy cryogenic metal-powder filters, which prove ineffective at sub-GHz frequency regimes and unsuitable for high-density quantum circuits such as spin qubits.
View Article and Find Full Text PDFOpen Res Eur
November 2024
Quantum Electronics, Physikalisch-Technische Bundesanstalt, Braunschweig, Lower Saxony, 38116, Germany.
We discuss the flip-chip mounting process of photodiodes and fiber sleeves on silicon substrates to meet the increasing demand for fabrication of highly integrated and hybrid quantum circuits for operation at cryogenic temperatures. To further increase the yield and success rate of the flip-chip procedure, the size of the gold stud bumps, and flip-chip parameters were optimized. Moreover, to connect optical fibers to the photodiodes in an optimal position, the fiber sleeves were aligned with specially fabricated alignment circles before applying thermocompression with the flip-chip machine.
View Article and Find Full Text PDFNano Lett
November 2024
Department of Physics, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, United States.
Van der Waals heterostructures have emerged as a versatile platform to study correlated and topological electron physics. Spectroscopy experiments in the THz regime are crucial since the energy of THz photons matches that of relevant excitations and charge dynamics. However, their micrometer size and complex (dual-)gated structures have challenged such measurements.
View Article and Find Full Text PDFRev Sci Instrum
November 2024
Department of Physics, University of California, Santa Barbara, California 93106, USA.
Microwave Kinetic Inductance Detectors (MKIDs) are superconducting detectors capable of single-photon counting with energy resolution across the ultraviolet, optical, and infrared (UVOIR) spectrum with microsecond timing precision. MKIDs are also multiplexable, providing a feasible way to create large-format, cryogenic arrays for sensitive imaging applications in biology, astronomy, and quantum information. Building large, cryogenic MKID arrays requires processing highly multiplexed, wideband readout signals in real time; this task has previously required large, heavy, and power-intensive custom electronics.
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