The conventional reconfiguration of transistors requires an additional independent terminal for controllable gate input, which complicates the device structure and makes circuit integration difficult. In this work, we propose a reconfigurable diode based on a 2D layered copper indium thiophosphate (CIPS) and graphene (Gr) van der Waals lateral heterojunction, exhibiting distinctively bias-dependent reconfiguration. The reconfiguration characteristics include reversible memristive behaviors with a current on/off ratio of about 10 and switchable rectifying polarity with a rectifying ratio of up to 3 × 10. This reconfigurable mechanism arises from the lateral bias-induced migration of Cu ions, effectively modulating the barrier height at the CIPS and Gr interface. This work provides a simplified reconfigurable solution for electrostatically modulated circuits.
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http://dx.doi.org/10.1039/d4nr03400g | DOI Listing |
J Contemp Dent Pract
September 2024
Department of Academic, Faculty of Dentistry, Universidad Nacional Federico Villarreal, Lima, Peru, ORCID: https://orcid.org/0000-0002-0594-5834.
Objective: To evaluate the shear strength of adhesives based on the type of solvent (ethanol and acetone), aged and light-cured using light-emitting diode (LED) units with different wavelengths. Polywave and monowave LED units were employed for this study.
Materials And Methods: Ninety bovine tooth samples were analyzed using OptiBond Universal adhesive (acetone) and single bond universal adhesive (ethanol).
Appl Spectrosc
January 2025
School of Mathematics Physics and Finance, Anhui Polytechnic University, Wuhu, China.
A compact dual-gas sensor based on the two near-infrared distributed feedback diode lasers and a multipass cell has been established for the simultaneous measurement of methane (CH) and acetylene (CH). The time division multiplexing calibration-free direct absorption spectroscopy is used to eliminate the cross interference in the application of multicomponent gas sensors. A wavelength stabilization technique based on the proportion integration differentiation feedback control is developed to suppress laser wavelength drift and an H-infinity (H) filter algorithm to reduce the system noise.
View Article and Find Full Text PDFACS Nano
January 2025
Institute of Functional Nano & Soft Materials (FUNSOM), Joint International Research Laboratory of Carbon-Based Functional Materials and Devices, Soochow University, Suzhou 215123, Jiangsu, China.
Thermally activated delayed fluorescence (TADF) materials have received increasing attention from organic electronics to other related fields, such as bioapplications and photocatalysts. However, it remains a challenging task for TADF emitters to showcase the versatility concurrent with high performance in multiple applications. Herein, we first present such a proof-of-concept TADF material, namely, QCN-SAC, through strategically manipulating exciton dynamics.
View Article and Find Full Text PDFChem Asian J
January 2025
Fujian Agriculture and Forestry University, College of Materials Engineering, No. 63, Xiyuangong Road, Minhou County, 350108, Fuzhou, CHINA.
Organic light-emitting diodes (OLEDs) has been attracting much extensive interest owing to their advantages of high-definition and flexible displays. Many advances have been focused on boosting the efficiency and stability. Two innovative dimethylacridine-based emitters,1,1,2,2-tetrakis(4- (2,7-di-tert-butyl-9,9-dimethylacridin-10(9H)-yl)phenyl ethene (AcTPE), and bis(4-(2,7-di-tert-butyl-9,9-dimethylacridin-10(9H)-yl)phenyl)methanone (Ac2BP) were designed and synthesized, in which TPE-baesed AcTPE presents AIE properties, and with the phenyl as spacer between the DMAC and carbony, aryl-ketone-based Ac2BP doesn't show AIE properties due to the absence of restriction of intramolecular rotations.
View Article and Find Full Text PDFNpj Flex Electron
October 2024
Thayer School of Engineering, Dartmouth College, Hanover, NH, 03755, USA.
The integration of flexible electronics and photonics has the potential to create revolutionary technologies, yet it has been challenging to marry electronic and photonic components on a single polymer device, especially through high-volume manufacturing. Here, we present a robust, chiplet-level heterogeneous integration of polymer-based circuits (CHIP), where several post-fabricated, ultrathin, polymer electronic, and optoelectronic chiplets are vertically bonded into one single chip at room temperature and then shaped into application-specific form factors with monolithic Input/Output (I/O). As a demonstration, we applied this process and developed a flexible 3D-integrated optrode with high-density arrays of microelectrodes for electrical recording and micro light-emitting diodes (μLEDs) for optogenetic stimulation while with unprecedented integration of additional temperature sensors for bio-safe operations and shielding designs for optoelectronic artifact prevention.
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