AI Article Synopsis

  • Blue laser annealing enhances the performance of thin-film transistors (TFTs) but faces challenges with low productivity and high costs due to the limitations of current lasers.
  • A new blue laser light source was developed using the wavelength beam combining method, achieving significant power density and increased scanning speed, which doubles the productivity compared to traditional laser methods.
  • The resulting laser annealing produced crystal grains ranging from 2 to 15 μm with a 100% crystallization rate and low resistivity, demonstrating a geometric rather than arithmetic increase in production capacity with higher laser power.

Article Abstract

Blue laser annealing can be used to obtain a high-mobility thin-film transistor (TFT) through a laser annealing (i.e., LTPS: low-temperature Poly-Si) process. However, the laser annealing process's low productivity (as well as high cost) is an issue because the high output power of blue lasers still needs to be addressed. Therefore, productivity can be improved if blue laser energy is efficiently supplied during the laser annealing process using a continuous wave laser instead of a conventional pulsed excimer laser. We developed a blue laser light source (440 ± 10 nm) using the wavelength beam combining (WBC) method, which can achieve a laser power density of 73.7 kW/cm. In this semiconductor laser, when the power was increased s by 2.9 times, the laser scanning speed was increased by 5.0 times, achieving twice the productivity of conventional lasers. After laser annealing, the size of the crystal grains varied between 2 and 15 μm, resulting in a crystallization rate of 100% by Raman scattering rsult and low resistivity of 0.04 Ωcm. This increase in production capacity is not an arithmetic increase with increased power but a geometric production progression.

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Source
http://www.ncbi.nlm.nih.gov/pmc/articles/PMC11595454PMC
http://dx.doi.org/10.3390/ma17225399DOI Listing

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