Nowadays, with the development of electromobility, the requirements not only for the mechanical properties but also for the thermal conductivity of castings are increasing. This paper investigates the influence of casting and heat treatment technology on the thermal diffusivity and thermal conductivity of an AlSi10MnMg alloy. The thermal diffusivity was monitored as a function of temperature in the range of 50-300 °C for the material cast by high-pressure die casting (HPDC) and also by gravity sand casting (GSC) and gravity die casting (GDC). This study also investigated the effect of the T5 heat treatment temperature (artificial ageing without prior solution treatment-HT200, HT300, and HT400) on the thermal conductivity of the material cast by different technologies. Experiments confirmed that the thermal diffusivity or thermal conductivity of the alloy depends on the casting technology. The slower the cooling rate of the casting, the higher the thermal conductivity value. For the alloy in the as-cast condition, the thermal conductivity at 50 °C is in the range of about 125 to 138 [W·m·K]. Regardless of the casting method, the thermal conductivity tends to increase with temperature (50-300 °C). Furthermore, a positive effect of heat treatment without prior solution treatment (HT200, HT300, and HT400) on the thermal conductivity was demonstrated. Regardless of the casting method of the samples, the thermal conductivity also increases with increasing heat treatment temperature. The results further showed that when artificial ageing is performed in industrial practice on castings to increase mechanical properties in the temperature range of 160-230 °C, this heat treatment has a positive effect on thermal conductivity.
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http://dx.doi.org/10.3390/ma17215329 | DOI Listing |
J Phys Chem Lett
January 2025
College of Electronic and Optical Engineering & College of Flexible Electronics (Future Technology), State Key Laboratory of Organic Electronics and Information Displays, Nanjing University of Posts and Telecommunications, Nanjing, Jiangsu 210023, P.R. China.
Heat dissipation has become a critical challenge in modern electronics, driving the need for a revolution in thermal management strategies beyond traditional packaging materials, thermal interface materials, and heat sinks. Cubic boron arsenide (c-BAs) offers a promising solution, thanks to its combination of high thermal conductivity and high ambipolar mobility, making it highly suitable for applications in both electronic devices and thermal management. However, challenges remain, particularly in the large-scale synthesis of a high-quality material and the tuning of its physical properties.
View Article and Find Full Text PDFNanomaterials (Basel)
January 2025
Guangdong Provincial Key Laboratory of Electronic Functional Materials and Devices, Huizhou University, Huizhou 516001, China.
Cu/Diamond (Cu/Dia) composites are regarded as next-generation thermal dissipation materials and hold tremendous potential for use in future high-power electronic devices. The interface structure between the Cu matrix and the diamond has a significant impact on the thermophysical properties of the composite materials. In this study, Cu/Dia composite materials were fabricated using the Spark Plasma Sintering (SPS) process.
View Article and Find Full Text PDFMater Horiz
January 2025
Department of Physics, Pukyong National University, Busan 48513, Korea.
Altermagnetism is a new class of material with zero net magnetization, but having a nonrelativistic spin-split band structure. Here, we investigate the multifunctional properties of the hexagonal wurtzite MnO (-MnO). -MnO has a direct band gap of 0.
View Article and Find Full Text PDFACS Appl Mater Interfaces
January 2025
International Advanced Research Centre for Powder Metallurgy and New Materials (ARCI), IIT M Research Park, Chennai 600113, India.
The MgSb-based layered compounds exhibit exceptional thermoelectric properties over a wide temperature range and possess the potential to supplant traditional BiTe modules with reliable and economical MgSb-based thermoelectric devices, contingent upon the availability of a complementary p-type MgSb material with high thermoelectric efficiency comparable to that of n-type MgSb. We provide a simpler method involving the codoping of monovalent atoms (K and Na) at the Mg site of the MgSb lattice to improve the thermoelectric performance of p-type MgSb. K-Na codoping results in a peak power factor of around 0.
View Article and Find Full Text PDFJ Chem Phys
December 2024
Department of Materials Science and Engineering, University of Michigan, Ann Arbor, Michigan 48109, USA.
Organic-inorganic hybrid materials are explored for application as solid electrolytes for lithium-ion batteries. The material consists of a porous silica network, of which the pores are infiltrated by poly(ethylene oxide) and lithium perchlorate. The synthesis involves two steps: First, the inorganic backbone is created by the acid-catalyzed sol-gel synthesis of tetraethyl orthosilicate to ensure continuity of the backbone in three dimensions.
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