AI Article Synopsis
- The trend of making electronic devices smaller while increasing their power output has led to significant heat management challenges.
- Traditional heat sinks are often inadequate, prompting researchers to explore new designs and optimization techniques for better thermal performance.
- The article reviews advancements in heat sink design, including enhanced surface geometries, microchannels, and computational fluid dynamics (CFD) modeling, as well as discussing fouling and its prevention.
Article Abstract
The ongoing trend towards miniaturizing electronic devices and increasing their power densities has created substantial challenges in managing the heat they produce. Traditional heat sink designs often fall short of meeting modern electronics' rigorous thermal management needs. As a result, researchers and engineers are turning to innovative heat sink designs and optimization methods to improve thermal performance. This review article offers an overview of the latest advancements in designing and optimising advanced heat sinks for electronic cooling. It explores various techniques to enhance heat transfer, including advanced surface geometries and microchannels. Additionally, the review covers computational fluid dynamics (CFD) modelling and experimental validation methods used to refine heat sink designs. Further insight into fouling and its prevention has been discussed. The insights provided in this article are intended to serve as a valuable resource for thermal engineers, and researchers focused on managing the heat in high-power electronic systems.
Download full-text PDF |
Source |
|---|---|
| http://www.ncbi.nlm.nih.gov/pmc/articles/PMC11482576 | PMC |
| http://dx.doi.org/10.1039/d4ra05845c | DOI Listing |
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