Influence of diode laser irradiation on microtensile bond strength of etch-and-rinse adhesive to dentin using two different etchants: An study.

Aim: The aim of this study was to evaluate the influence of 970 nm diode laser (DL) irradiation on the microtensile bond strength (TBS) of etch-and-rinse adhesive (ERA) to dentin using phosphoric acid (PA) or alpha-hydroxy glycolic acid (GA) as etchants.

Materials And Methods: A total of 32 human third molars were selected and assigned randomly among two different groups and four subgroups based on etching protocols and DL irradiation: PA, PA-DL, GA, and GA-DL. After tooth preparation and subsequent incremental composite build-up, the samples were stored in distilled water for 24 h at 37°C. TBS values were obtained using the universal testing machine. The failure modes observed in dentin were categorized as adhesive, cohesive within dentin/resin, or mixed.

Statistical Analysis: The data were analyzed using one-way analysis of variance, followed by Tukey's test ( ≤ 0.001).

Results: GA showed better or similar bond strength values to PA. Furthermore, irradiation of DL increased the TBS to dentin when both PA or GA are used as etchants.

Conclusion: GA can be used as an alternative etchant to PA. DL irradiation stands as a promising approach for elevating the performance of ERA adhesive systems to dentin.