AI Article Synopsis

  • Ideal thermoelectric materials should have a high average ZT, which is affected by carrier mobility and density; traditional doping techniques make it hard to optimize performance across different temperatures.
  • This study shows that combining lattice plainification with dynamic doping can significantly enhance the average ZT of N-type PbSe by improving carrier mobility and allowing for better control over carrier concentration.
  • The modified PbSe, incorporating both Sn and a small amount of Cu, achieves a maximum ZT of about 1.7 at 800 K and demonstrates a promising 7.7% power generation efficiency, making it a strong candidate for commercial use.

Article Abstract

Ideal thermoelectrics shall possess a high average ZT, which relies on high carrier mobility and appropriate carrier density at operating temperature. However, conventional doping usually results in a temperature-independent carrier concentration, making performance optimization over a wide temperature range be challenging. This work demonstrates the combination of lattice plainification and dynamic doping strategies is an effective route to boost the average ZT of N-type PbSe. Because Sn and Pb have similar ionic radii and electronegativity, this allows Sn to fill the intrinsic Pb vacancies and effectively improves the carrier mobility of PbSe to 1300 cm V s. Furthermore, a trace amount of Cu is introduced into the Sn-filled PbSe to optimize the carrier concentration. The extra Cu is situated in the interstitial sides of the lattice, which undergoes a dissolution-precipitation process with temperature, leading to a strongly temperature-dependent carrier density in the material. This dynamic doping effectively improves the electrical transport properties and is also valid to suppress the lattice thermal conductivity. Ultimately, the resulting PbSnSe+3‰Cu obtains a maximum ZT of ≈1.7 at 800 K and an average ZT of ≈1.0, with a 7.7% power generation efficiency in a single-arm device, showing significant potential for commercial application.

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Source
http://dx.doi.org/10.1002/smll.202407556DOI Listing

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