Monolithic integration of color-conversion materials onto blue-backlight micro-light-emitting-diodes (micro-LEDs) has emerged as a promising strategy for achieving full-color microdisplay devices. However, this approach still encounters challenges such as the blue-backlight leakage and the poor fabrication yield rate due to unsatisfied quantum dot (QD) material and fabrication process. Here, the monolithic integration of 0.39-inch micro-display screens displaying colorful pictures and videos are demonstrated, which are enabled by creating interfacial chemical bonds for wafer-scale adhesion of sub-5 µm QD-pixels on blue-backlight micro-LED wafer. The ligand molecule with chlorosulfonyl and silane groups is selected as the synthesis ligand and surface treatment material, facilitating the preparation of high-efficiency QD photoresist and the formation of robust chemical bonds for pixel integration. This is a leading record in micro-display devices achieving the highest brightness larger than 400 thousand nits, the ultrahigh resolution of 3300 PPI, the wide color gamut of 130.4% NTSC, and the ultimate performance of service life exceeding 1000 h. These results extend the mature integrated circuit technique into the manufacture of micro-display device, which also lead the road of industrialization process of full-color micro-LEDs.
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http://dx.doi.org/10.1002/adma.202409025 | DOI Listing |
Anal Chem
December 2024
Department of Chemistry, National Chung Hsing University, Taichung City 402202, Taiwan, ROC.
Four-dimensional printing (4DP) technologies can expand the functionality of stimuli-responsive devices to enable the integration of multiple stimuli-responsive parts into a compact device. Herein, we used digital light processing three-dimensional printing technique, flexible photocurable resins, and photocurable resins of the temperature-responsive hydrogels comprising -isopropylacrylamide (NIPAM), ,'-methylenebis(acrylamide) (MBA), and graphene for 4DP of a lab-on-valve (LOV) solid-phase extraction (SPE) device. This device featured flow manifolds and a monolithic packing connected by four near-infrared (NIR)-actuated temperature-responsive switching valves composed of a poly(NIPAM/MBA) (PNM) ball pushing a flexible membrane.
View Article and Find Full Text PDFJ Chromatogr B Analyt Technol Biomed Life Sci
December 2024
School of Pharmacy, Jiangsu University, Zhenjiang 212013, China. Electronic address:
In order to enrich the selection of biological ligands, realize the miniaturization analysis, and broaden the application of monolith materials for active ingredients screening and separating, we sough to construct a lipid raft @capillary monolith microcolumn affinity chromatography model. Single factor experiments and various characterization methods, including scanning electron microscopy (SEM) and thermogravimetric analysis, were employed to investigate the polymerization of the monolith column under different material ratios to determine optimal preparation conditions. Subsequently, the lipid raft from U251 cells was integrated with the monolith materials based on epoxy-based covalent crosslinking principle and characterized through SEM and immunofluorescence methods.
View Article and Find Full Text PDFJ Mech Behav Biomed Mater
December 2024
Oral Technology, Dental School, University Hospital Bonn, Bonn, Germany. Electronic address:
Nanoscale
December 2024
School of Environmental and Chemical Engineering, Jiangsu University of Science and Technology, Zhenjiang 212003, China.
Multiple functional tailored materials have shown great potential for both pollutant degradation and freshwater recovery. In this study, we synthesized densely distributed Co onto carbon-layer-coated Ni/AlO hydrangea composites (Ni/AlO@Co) the polymerization of dopamine under a controlled graphitized process. The characterization results revealed that Ni/AlO@Co, with abundant exposed bimetallic Co-Ni species on the surface of AlO, could afford accessible catalytic sites for persulphate activation and subsequent pollutant degradation.
View Article and Find Full Text PDFNature
December 2024
Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA.
The demand for the three-dimensional (3D) integration of electronic components is steadily increasing. Despite substantial processing challenges, the through-silicon-via (TSV) technique emerges as the only viable method for integrating single-crystalline device components in a 3D format. Although monolithic 3D (M3D) integration schemes show promise, the seamless connection of single-crystalline semiconductors without intervening wafers has yet to be demonstrated.
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