In this work, we report an n-type metal-oxide-semiconductor (nMOS) inverter using chemical vapor deposition (CVD)-grown monolayer WS field-effect transistors (FETs). Our large-area CVD-grown monolayer WS FETs exhibit outstanding electrical properties including a high on/off ratio, small subthreshold swing, and excellent drain-induced barrier lowering. These are achieved by n-type doping using AlO/AlO and a double-gate structure employing high- dielectric HfO. Due to the superior subthreshold characteristics, monolayer WS FETs show high transconductance and high output resistance in the subthreshold regime, resulting in significantly higher intrinsic gain compared to conventional Si MOSFETs. Therefore, we successfully realize subthreshold operating monolayer WS nMOS inverters with extremely high gains of 564 and 2056 at supply voltage () of 1 and 2 V, respectively, and low power consumption of ∼2.3 pW·μm at = 1 V. In addition, the monolayer WS nMOS inverter is further expanded to the demonstration of logic circuits such as AND, OR, NAND, NOR logic gates, and SRAM. These findings suggest the potential of monolayer WS for high-gain and low-power logic circuits and validate the practical application in large areas.

Download full-text PDF

Source
http://dx.doi.org/10.1021/acsnano.4c04316DOI Listing

Publication Analysis

Top Keywords

nmos inverter
12
high-gain low-power
8
subthreshold regime
8
cvd-grown monolayer
8
monolayer fets
8
monolayer nmos
8
logic circuits
8
monolayer
7
subthreshold
5
realization extremely
4

Similar Publications

The intrinsic n-type behavior and unavailability of the appropriate p-type doping method for MoS allows only n-type conduction with depletion mode (D-mode) characteristics and forbids the implementation of p-type field-effect transistors (FETs). The D-mode characteristic results in a high off-current (I) at zero gate bias, which limits the usage of MoS FETs for industry-scale (n-channel metal-oxide semiconductor) NMOS/(complementary metal-oxide semiconductor) CMOS-logic-based applications due to significant power dissipation. Both these issues, i.

View Article and Find Full Text PDF

Ultrathin α-BiO Thin-Film Transistor for Cost-Effective Oxide-TFT Inverters.

ACS Appl Mater Interfaces

November 2024

Material Science and Engineering Program, University of California San Diego, La Jolla, California 92093, United States.

Electronics is advancing toward greater diversity and sustainability by prioritizing energy efficiency and cost-effectiveness. Metal oxide thin-film transistor (TFT) represents a technology at the forefront of advancing next-generation sustainable electronics, and exploring oxide channel compositions is a crucial step in opening opportunities for developing next-generation device applications. This study presents the first development of n-channel α-BiO-TFTs using a 4 nm ultrathin channel prepared by a cost-effective vacuum-free and solvent-free liquid metal printing method in ambient air.

View Article and Find Full Text PDF

In this work, we report an n-type metal-oxide-semiconductor (nMOS) inverter using chemical vapor deposition (CVD)-grown monolayer WS field-effect transistors (FETs). Our large-area CVD-grown monolayer WS FETs exhibit outstanding electrical properties including a high on/off ratio, small subthreshold swing, and excellent drain-induced barrier lowering. These are achieved by n-type doping using AlO/AlO and a double-gate structure employing high- dielectric HfO.

View Article and Find Full Text PDF

Enhancement-Mode Ambipolar Thin-Film Transistors and CMOS Logic Circuits using Bilayer GaO/NiO Semiconductors.

ACS Appl Mater Interfaces

February 2024

Advanced Semiconductor Laboratory, Electrical and Computer Engineering Program, King Abdullah University of Science and Technology (KAUST), Thuwal 23955-6900, Kingdom of Saudi Arabia.

Recent advancements in power electronics have been driven by GaO-based ultrawide bandgap (UWBG) semiconductor devices, enabling efficient high-current switching. However, integrating GaO power devices with essential silicon CMOS logic circuits for advanced control poses fabrication challenges. Researchers have introduced GaO-based NMOS and pseudo-CMOS circuits for integration, but these circuits may either consume more power or increase the design complexity.

View Article and Find Full Text PDF

Applying a drain bias to a strongly gate-coupled semiconductor influences the carrier density of the channel. However, practical applications of this drain-bias-induced effect in the advancement of switching electronics have remained elusive due to the limited capabilities of its current modulation known to date. Here, we show strategies to largely control the current by utilizing drain-bias-induced carrier type switching in an ambipolar molybdenum disulfide (MoS) field-effect transistor with Pt bottom contacts.

View Article and Find Full Text PDF

Want AI Summaries of new PubMed Abstracts delivered to your In-box?

Enter search terms and have AI summaries delivered each week - change queries or unsubscribe any time!