As an environmentally friendly material, biochar is increasingly being utilized in the field of heat transfer and thermal conduction. In this study, nano-biochar was prepared from high-pressure homogenization (HPH) using sesame stalks as the raw material. It was incorporated into ethylene glycol (EG) and its dispersion stability, viscosity, and thermal conductivity were investigated. The nano-biochar was stably dispersed in EG for 28 days. When the concentration of the nano-biochar added to EG was less than 1%, the impact on viscosity was negligible. The addition of 5 wt.% nano-biochar to EG improved the thermal conductivity by 6.72%, which could be attributed to the graphitized structure and Brownian motion of the nano-biochar. Overall, nano-biochar has the potential to be applied in automotive thermal management.
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http://dx.doi.org/10.3390/nano14151308 | DOI Listing |
Sci Rep
January 2025
Department of Mechanical Engineering, College of Engineering and Computer Sciences, Jazan University, P.O Box 45124, Jazan, Saudi Arabia.
Fluid flow across a Riga Plate is a specialized phenomenon studied in boundary layer flow and magnetohydrodynamic (MHD) applications. The Riga Plate is a magnetized surface used to manipulate boundary layer characteristics and control fluid flow properties. Understanding the behavior of fluid flow over a Riga Plate is critical in many applications, including aerodynamics, industrial, and heat transfer operations.
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January 2025
Department of Agricultural Engineering, Kongunadu College of Engineering and Technology, Trichy, Tamil Nadu, India.
This study investigates the enhancement of solar cell efficiency using nanofluid cooling systems, focusing on citrate-stabilized and PVP-stabilized silver nanoparticles. Traditional silicon-based and perovskite solar cells were examined to assess the impact of these nanofluids on efficiency improvement and thermal management. A Central Composite Design (CCD) was employed to vary nanoparticle concentration (0.
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January 2025
Guangdong Provincial Key Laboratory of Optical Information Materials and Technology & Institute of Electronic Paper Displays, South China Academy of Advanced Optoelectronics, South China Normal University, Guangzhou, 510006, PR China.
Conventional electronic chip packaging generates a huge thermal resistance due to the low thermal conductivity of the packaging materials that separate chip dies and coolant. Here we propose and fabricate a closed high-conducting heat chip package based on passive phase change, using silicon carbide which is physically and structurally compatible with chip die materials. Our "chip on vapor chamber" (CoVC) concept realizes rapid diffusion of hot spots, and eliminates the high energy consumption of refrigeration ordinarily required for heat management.
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January 2025
Kanagawa University, Department of Chemistry, JAPAN.
Thermoelectric properties of undoped crystals of dibenzo[g,p]chrysene (DBC), deuterated DBC (DBC-d16), and 2,10-dimethyl-DBC (DBC-Me2) have been studied to obtain some insights into the relationship between the structural parameters of materials and the giant Seebeck effect. X-ray crystallography showed one-dimensional columnar packing with the interlayer distances (d) for DBC-d16, DBC, and DBC-Me2 were 3.78 Å, 3.
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January 2025
State Key Laboratory of Materials Processing and Die & Mould Technology, and School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, Hubei, P. R. China.
Intensifying the severity of electromagnetic (EM) pollution in the environment represents a significant threat to human health and results in considerable energy wastage. Here, we provide a strategy for electricity generation from heat generated by electromagnetic wave radiation captured from the surrounding environment that can reduce the level of electromagnetic pollution while alleviating the energy crisis. We prepared a porous, elastomeric, and lightweight BiTe/carbon aerogel (CN@BiTe) by a simple strategy of induced in situ growth of BiTe nanosheets with three-dimensional (3D) carbon structure, realizing the coupling of electromagnetic wave absorption (EMA) and thermoelectric (TE) properties.
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