Combining electrodeposition and heat treatment is an effective method to successfully fabricate CuSn alloy materials, in which the S2 alloy electrode is electrodeposited at 1.2 A dm current density with uniform and compact morphology. The characterization results show that monoclinic η'-CuSn and hexagonal η-CuSn phases fabricated at the appropriate current density exhibit excellent electrochemical performance. The optimal CuSn alloy anode material boasts not just a significantly high discharge specific capacity of 890.2 mA h g with an initial coulombic efficiency (ICE) of 73.96%, but also achieves an adequate discharge specific capacity of 287.1 after 50 cycles at 100 mA h g. Moreover, the electrodeposited CuSn alloy materials also possessed a lower transfer resistance of 42.45 Ω and an improved lithium-ion diffusion coefficient of 2.665 × 10 cm s at the current density of 1.2 A dm. Therefore, preparing the CuSn alloy thin-film electrode could be a cost-effective and straightforward method by electrodeposition from cyanide-free plating baths to develop anode components suitable for lithium-ion battery applications.
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http://dx.doi.org/10.1039/d4ra04562a | DOI Listing |
Sci Rep
January 2025
Physical Chemistry Department, National Research Centre, 33 El Bohouth Street, P.O.12622, Dokki, Giza, Egypt.
Archaeological coins are considered essential sources of historical documentation. Over time, they are subjected to corrosion processes that gradually alter their appearance, shape, and composition. This study aims to evaluate the effects of the patina and/or protective coating on the corrosion process.
View Article and Find Full Text PDFChem Commun (Camb)
January 2025
School of Chemistry and Chemical Engineering, Northwestern Polytechnical University, Xi'an, Shaanxi 710072, China.
A molecular ligand separation method based on multivariate metal-organic frameworks (MOF) is developed to precisely regulate CuSn alloy for tuning the selectivity of HCOOH and CO in CO reduction. With this method, the agglomeration and heterogeneous nucleations of metals are effectively inhibited during the electrochemical transformation of CuSn-MOFs into highly pure CuSn alloy. The low Sn content favors CO production, while the high Sn concentration facilitates HCOOH formation.
View Article and Find Full Text PDFNanoscale Horiz
November 2024
Department of Energy Science and Engineering, Daegu Gyeongbuk Institute of Science and Technology (DGIST), Daegu 42988, Republic of Korea.
In the electrochemical CO reduction reaction (CORR), Cu alloy electrocatalysts can control the CORR selectivity by modulating the intermediate binding energy. Here, we report the thermodynamic-based Cu-Sn bimetallic phase control in heterogeneous catalysts for selective CO conversion. Starting from the thermodynamic understanding about Cu-Sn bimetallic compounds, we established the specific processing window for Cu-Sn bimetallic phase control.
View Article and Find Full Text PDFAngew Chem Int Ed Engl
November 2024
College of Chemistry and Chemical Engineering, College of Energy Material and Chemistry, Inner Mongolia University, Hohhot, 010021, China.
The photoelectrochemical reduction of nitrate to ammonia (PEC NORR) has emerged as a promising pathway for facilitating the natural nitrogen cycle. The PEC NORR can lower the reduction potential needed for ammonia synthesis through photogenerated voltage, showcasing the significant potential for merging abundant solar energy with sustainable nitrogen fixation. However, it is influenced by the selective photocathodes with poor carrier kinetics, low catalytic selectivity, and ammonia yields.
View Article and Find Full Text PDFHeliyon
June 2024
School of Intelligent Manufacturing and Materials Engineering, Gannan University of science and technology, Ganzhou 341000, China.
The copper crystal cone-shaped micro-nanostructure is used as the substrate, and the Ni-W alloy layer and Au nanolayer are plated sequentially. Instantaneous soldering with lead-free solder is realized under ultrasonic assistance at room temperature. This solves the residual stress and thermal damage caused by high melting point lead-free solder on thin chips and thermal components, and ensures the safety and reliability of electronic components.
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