AI Article Synopsis
- A new silicon mold process using picosecond lasers offers an alternative to traditional SU-8 soft lithography for creating PDMS microchannel chips, achieving a minimum feature size of 50 μm.
- The silicon patterns are created by cutting a 550 μm thick silicon wafer, then processed to remove debris and a protective oxide layer before being bonded to glass substrates via anodic bonding.
- This maskless process does not require a photolithography facility, although it does need specialized laser cutting services from off-campus providers, and demonstrates potential applications like particle separation in PDMS microchannel chips.
Article Abstract
As an alternative to SU-8 soft lithography, a new silicon mold process of fabricating PDMS microchannel chips was proposed. A picosecond laser is used to cut through a 550 μm thick silicon wafer and generate the original microchannel pattern with a 50 μm minimum feature size. This single-crystal silicon pattern, with the edge debris caused by laser cutting being trimmed off by a KOH solution and with the protection field oxide layer being removed by BOE afterwards, firmly resided on a glass substrate through the anodic bonding technique. Four-inch wafers with microchannel patterns as the PDMS mold cores were successfully bonded on Pyrex 7740 or Eagle XG glass substrates for the follow-up PDMS molding/demolding process. This new maskless process does not need a photolithography facility, but the laser cutting service must be provided by professional off-campus companies. One PDMS microchannel chip for particle separation was shown as an example of what can be achieved when using this new process.
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Source |
|---|---|
| http://www.ncbi.nlm.nih.gov/pmc/articles/PMC11279147 | PMC |
| http://dx.doi.org/10.3390/mi15070848 | DOI Listing |
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