Stretchable electronics commonly assemble multiple material modules with varied bulk moduli and surface chemistry on one packaging substrate. Preventing the strain-induced delamination between the module and the substrate has been a critical challenge. Here we develop a packaging substrate that delivers mechanically stable module/substrate interfaces for a broad range of stiff and stretchable modules with varied surface chemistries. The key design of the substrate was to introduce module-specific stretchability and universal adhesiveness by regionally tuning the bulk molecular mobility and surface molecular polarity of a near-hermetic elastic polymer matrix. The packaging substrate can customize the deformation of different modules while avoiding delamination upon stretching up to 600%. Based on this substrate, we fabricated a fully stretchable bioelectronic device that can serve as a respiration sensor or an electric generator with an in vivo lifetime of 10 weeks. This substrate could be a versatile platform for device assembly.
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http://dx.doi.org/10.1038/s41467-024-50494-8 | DOI Listing |
Bioresour Technol
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University of Zagreb Faculty of Chemical Engineering and Technology, Marulićev trg 19, HR-10000 Zagreb, Croatia. Electronic address:
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Department of Semiconductor System Engineering, Sejong University, Seoul 05006, Republic of Korea.
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Zhejiang Xinsheng Semiconductor Technology, Zhuji 311899, China.
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December 2024
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Department of Biomechatronics Engineering, National Taiwan University, Taipei 10617, Taiwan.
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