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Application of supercritical carbon dioxide to enhance the aroma of whole sorghum flour for use in 3D printing of sorghum cookies. | LitMetric

Application of supercritical carbon dioxide to enhance the aroma of whole sorghum flour for use in 3D printing of sorghum cookies.

Food Res Int

Department of Food Science, University of Arkansas, Fayetteville, AR 72704, USA; Department of Biological and Agricultural Engineering, University of Arkansas, Fayetteville, AR 72701, USA. Electronic address:

Published: August 2024

Sorghum is a promising ingredient for new food products due to its high fiber content, slow digestibility, drought resistance, and gluten-free nature. One of the main challenges in sorghum-based products is the unpleasant aroma compounds found in grain sorghum. Therefore, in this study, sorghum flour was treated via supercritical carbon dioxide (SC-CO) to remove undesired aroma compounds. The resulting SC-CO-treated flours were used to generate dough for 3D food printing. At the optimized conditions, sorghum cookies were 3D-printed using 60 % water and a nozzle diameter of 1.5 mm. All dough samples produced with untreated and SC-CO-treated sorghum flours exhibited shear-thinning behavior. Changing the treatment pressure (8-15 MPa) or temperature (40-60 °C) did not significantly affect the viscosity of the dough samples. Moreover, the sorghum cookie doughs had higher G' and G″ values after the SC-CO treatments (G' > G″). Doughs generated from flours treated at 15 MPa - 40 °C and 8 MPa - 60 °C showed lower adhesiveness compared to the ones produced from untreated flour, whereas 15 MPa - 60 °C treatment did not affect the adhesiveness. After baking, the 3D-printed cookies from SC-CO-treated flour exhibited significantly lower redness (a*), but the hardness of the cookies was not affected by SC-CO treatment. Overall, the SC-CO treatment of sorghum flour did not negatively affect the quality parameters of the 3D-printed cookies while enhancing the aroma of the flour.

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Source
http://dx.doi.org/10.1016/j.foodres.2024.114588DOI Listing

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