AI Article Synopsis
- The article discusses the creation of Cu/diamond composite coatings on steel substrates through an electrochemical method, comparing them to regular copper coatings lacking diamond nanoparticles.
- The coatings were produced using multicomponent electrolytes at a specific current density and magnetic stirring speed, with different concentrations of diamond nanoparticles included.
- The study evaluates various properties of the coatings, such as surface morphology, roughness, mechanical strength, adhesion to the substrate, and their solderability through tests focusing on spreadability, wettability, and bond durability.
Article Abstract
This article presents Cu/diamond composite coatings produced by electrochemical reduction on steel substrates and a comparison of these coatings with a copper coating without diamond nanoparticles (<10 nm). Deposition was carried out using multicomponent electrolyte solutions at a current density of 3 A/dm and magnetic stirring speed of 100 rpm. Composite coatings were deposited from baths with different diamond concentrations (4, 6, 8, 10 g/dm). This study presents the surface morphology and structure of the produced coatings. The surface roughness, coating thickness (XRF), mechanical properties (DSI), and adhesion of coatings to substrates (scratch tests) were also characterized. The coatings were also tested to assess their solderability, including their spreadability, wettability of the solder, durability of solder-coating bonds, and a microstructure study.
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| http://www.ncbi.nlm.nih.gov/pmc/articles/PMC11204481 | PMC |
| http://dx.doi.org/10.3390/ma17122803 | DOI Listing |
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