Editorial for the Special Issue on Advanced Interconnect and Packaging, 2nd Edition.

Micromachines (Basel)

School of Electronics and Information and School of Integrated Circuit Science and Engineering, Hangzhou Dianzi University, Hangzhou 310018, China.

Published: May 2024

Interconnect and packaging technologies are crucial aspects of modern electronics, and they are essential to achieve high performance, miniaturization and low power consumption of electronic equipment [...].

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Source
http://www.ncbi.nlm.nih.gov/pmc/articles/PMC11122919PMC
http://dx.doi.org/10.3390/mi15050643DOI Listing

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