For decades, Moore's Law has neared its limits, posing significant challenges to further scaling it down. A promising avenue for extending Moore's Law lies in three-dimensional integrated circuits (3D ICs), wherein multiple interconnected device layers are vertically bonded using Cu-Cu bonding. The primary bonding mechanism involves Cu solid diffusion bonding. However, the atomic diffusion rate is notably low at temperatures below 300 °C, maintaining a clear and distinct weak bonding interface, which, in turn, gives rise to reliability issues. In this study, a new method of surface modification using epoxy resin to form fine grains on a nanotwinned Cu film was proposed. When bonded at 250 °C, the interfacial grains grew significantly into both sides of the Cu film. When bonded at 300 °C, the interfacial grains extended extensively, eventually eliminating the original bonding interface.
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http://dx.doi.org/10.3390/nano14090771 | DOI Listing |
ACS Appl Bio Mater
January 2025
Physics Department, Federal University of Viçosa, Viçosa, Minas Gerais 36570-900, Brazil.
This study investigates the functionalization of gold-coated magnetoelastic sensors with thionine molecules, focusing on resonance frequency shifts. The functionalization process was characterized by using Raman spectroscopy and analyzed via scanning electron microscopy and atomic force microscopy, revealing the progressive formation of molecular clusters over time. Our results demonstrate that longer functionalization time leads to saturation of surface coverage and cluster formation, impacting the sensor's resonance frequency shifts.
View Article and Find Full Text PDFAnal Chem
January 2025
Rural Health Research Institute, Charles Sturt University, Orange, New South Wales 2800, Australia.
The detection and analysis of circulating cell-free nucleic acid (ccfNA) biomolecules are redefining a new era of molecular targeted cancer therapies. However, the clinical translation of electrochemical ccfNA biosensing remains hindered by unresolved challenges in analytical specificity and sensitivity. In this Perspective, we present a novel electrochemical framework for improving ccfNA biosensor performance by optimizing the critical electrode-biomolecules-electrolyte interfaces.
View Article and Find Full Text PDFmBio
January 2025
Department of Microbiology, Harvard Medical School, Boston, Massachusetts, USA.
The 55-carbon isoprenoid, undecaprenyl-phosphate (UndP), is a universal carrier lipid that ferries most glycans and glycopolymers across the cytoplasmic membrane in bacteria. In addition to peptidoglycan precursors, UndP transports O-antigen, capsule, wall teichoic acids, and sugar modifications. How this shared but limited lipid is distributed among competing pathways is just beginning to be elucidated.
View Article and Find Full Text PDFAngew Chem Int Ed Engl
January 2025
Harbin Institute of Technology, School of Chemistry and Chemical Engineering, No. 92, West Dazhi Street, 150001, Harbin, CHINA.
Commercial hard carbon (HC) anode suffers from unexpected interphase chemistry rooted in the parasitic reactions between surface oxygen-functional groups and ester-based electrolytes. Herein, an innovative strategy is proposed to regulate interphase chemistry by tailoring targeted functional groups on the HC surface, where highly active undesirable oxygen-functional groups are skillfully converted into a Si-O-Si molecular layer favorable for anchoring anions. Then, an inorganic/organic hybrid solid electrolyte interphase with low interfacial charge transfer resistance and enhanced cycling durability is constructed successfully.
View Article and Find Full Text PDFMater Horiz
January 2025
New Chemistry Unit, Jawaharlal Nehru Centre for Advanced Scientific Research, Jakkur, Bengaluru 560064, India.
The complex synthetic approach and utilization of toxic chemicals restrain the commercialization of numerous existing superhydrophobic materials. This article focuses on the development of a halogen-free superhydrophobic material for self-cleaning applications. HMDS-modified MCM-41 is employed as the base material.
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