Severity: Warning
Message: file_get_contents(https://...@pubfacts.com&api_key=b8daa3ad693db53b1410957c26c9a51b4908&a=1): Failed to open stream: HTTP request failed! HTTP/1.1 429 Too Many Requests
Filename: helpers/my_audit_helper.php
Line Number: 176
Backtrace:
File: /var/www/html/application/helpers/my_audit_helper.php
Line: 176
Function: file_get_contents
File: /var/www/html/application/helpers/my_audit_helper.php
Line: 250
Function: simplexml_load_file_from_url
File: /var/www/html/application/helpers/my_audit_helper.php
Line: 3122
Function: getPubMedXML
File: /var/www/html/application/controllers/Detail.php
Line: 575
Function: pubMedSearch_Global
File: /var/www/html/application/controllers/Detail.php
Line: 489
Function: pubMedGetRelatedKeyword
File: /var/www/html/index.php
Line: 316
Function: require_once
Efficient interactions between an adhesive and a substrate surface at the molecular level are the basis for the formation of robust adhesion, which substantially relies on interfacial wetting. However, strong adhesives usually improve cohesion but compromise interfacial properties. Herein, we have reported a kind of robust supramolecular adhesive based on the outstanding mobility and interfacial wettability of adhesive precursors. fast photopolymerization endows supramolecular adhesives with more outstanding adhesion for both smooth and rough surfaces in air and underwater in contrast to their counterparts from thermal polymerization. In addition to their low viscosity and high monomer concentration, supramolecular adhesive precursors without any organic solvents possess well-defined hydrogen bonding interactions. These superior properties consistently contribute to the wetting of the substrate and the formation of adhesive polymers with high molecular weights. This work highlights that enhancing interfacial wetting between an adhesive and a substrate is a promising route to achieving robust adhesion.
Download full-text PDF |
Source |
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http://www.ncbi.nlm.nih.gov/pmc/articles/PMC11062117 | PMC |
http://dx.doi.org/10.1039/d4sc01188k | DOI Listing |
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