Dynamic random-access memory (DRAM) capacitor electrodes, exemplified by TiN, face performance limitations owing to their relatively low work functions in addition to the formation of a low-k interfacial layer caused by their insufficient chemical stability. With recent advances in device scaling, these issues have become increasingly problematic, prompting the exploration of alternative electrode materials to replace TiN. Molybdenum dioxide (MoO) has emerged as a promising candidate for this application, outperforming TiN due to its low resistivity, high work function (>5 eV), and excellent chemical stability. Moreover, monoclinic MoO exhibits a distorted rutile structure, enabling the in situ growth of high-k rutile TiO on MoO at low deposition temperatures. However, MoO deposition poses challenges because of its metastable nature compared to the more stable molybdenum oxide (MoO) phases, such as MoO and MoO. In this work, we successfully fabricated Sn-doped MoO (TMO) films by atomic layer deposition (ALD) at 300 °C. A stabilized monoclinic MoO phase was achieved using ALD by incorporating SnO into MoO on both SiO and TiN substrates. The ALD TMO process comprised MoO and SnO subcycles, and the MoO:SnO subcycle ratio was varied from 100:1 to 20:1. High growth rates ranging from 0.19 to 0.34 nm/cycle were achieved for ALD TMO with varying the MoO:SnO subcycle ratio from 20:1 to 100:0. After post-deposition annealing at 500 °C, polycrystalline TMO films were obtained with smooth surface morphology. ALD TMO exhibited excellent interface quality with ALD TiO, possessing a negligible low-k interfacial layer. Moreover, a rutile TiO film with a high dielectric constant of 136 was successfully grown on a 20% Sn-TMO electrode. Overall, this study provides a strategy to stabilize metastable MoO films using ALD, and it demonstrates the superiority of ALD TMO as a promising DRAM capacitor electrode material.
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http://dx.doi.org/10.1021/acsami.4c03158 | DOI Listing |
ACS Appl Mater Interfaces
April 2024
Department of Materials Science and Engineering, Seoul National University of Science and Technology, Seoul 01811, Republic of Korea.
ACS Appl Mater Interfaces
September 2020
Technical Physics Division, Bhabha Atomic Research Centre, Trombay, Mumbai 400085, India.
The interface of transition-metal dichalcogenides (TMDCs) and high- dielectric transition-metal oxides (TMOs) had triggered umpteen discourses because of the indubitable impact of TMOs in reducing the contact resistances and restraining the Fermi-level pinning for the metal-TMDC contacts. In the present work, we focus on the unresolved tumults of large-area TMDC/TMO interfaces, grown by adopting different techniques. Here, on a pulsed laser-deposited MoS thin film, a layer of TiO is grown by atomic layer deposition (ALD) and pulsed laser deposition (PLD).
View Article and Find Full Text PDFAdv Mater
December 2017
Department of Mechanical and Materials Engineering, University of Western Ontario, London, ON, N6A 5B9, Canada.
A novel two-step surface modification method that includes atomic layer deposition (ALD) of TiO followed by post-annealing treatment on spinel LiNi Mn O (LNMO) cathode material is developed to optimize the performance. The performance improvement can be attributed to the formation of a TiMn O (TMO)-like spinel phase resulting from the reaction of TiO with the surface LNMO. The Ti incorporation into the tetrahedral sites helps to combat the impedance growth that stems from continuous irreversible structural transition.
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