AI Article Synopsis

  • DRAM capacitor electrodes like TiN have performance issues due to low work functions and unstable interfacial layers, prompting the search for better materials.
  • Molybdenum dioxide (MoO) has emerged as a superior alternative, boasting increased resistivity, a high work function, and good chemical stability, plus it allows for low-temperature growth of high-k rutile TiO.
  • The study successfully created Sn-doped MoO films using atomic layer deposition (ALD) at 300 °C, achieving a stabilized form of MoO with excellent interface quality and high dielectric properties, showcasing its potential for use in DRAM capacitors.

Article Abstract

Dynamic random-access memory (DRAM) capacitor electrodes, exemplified by TiN, face performance limitations owing to their relatively low work functions in addition to the formation of a low-k interfacial layer caused by their insufficient chemical stability. With recent advances in device scaling, these issues have become increasingly problematic, prompting the exploration of alternative electrode materials to replace TiN. Molybdenum dioxide (MoO) has emerged as a promising candidate for this application, outperforming TiN due to its low resistivity, high work function (>5 eV), and excellent chemical stability. Moreover, monoclinic MoO exhibits a distorted rutile structure, enabling the in situ growth of high-k rutile TiO on MoO at low deposition temperatures. However, MoO deposition poses challenges because of its metastable nature compared to the more stable molybdenum oxide (MoO) phases, such as MoO and MoO. In this work, we successfully fabricated Sn-doped MoO (TMO) films by atomic layer deposition (ALD) at 300 °C. A stabilized monoclinic MoO phase was achieved using ALD by incorporating SnO into MoO on both SiO and TiN substrates. The ALD TMO process comprised MoO and SnO subcycles, and the MoO:SnO subcycle ratio was varied from 100:1 to 20:1. High growth rates ranging from 0.19 to 0.34 nm/cycle were achieved for ALD TMO with varying the MoO:SnO subcycle ratio from 20:1 to 100:0. After post-deposition annealing at 500 °C, polycrystalline TMO films were obtained with smooth surface morphology. ALD TMO exhibited excellent interface quality with ALD TiO, possessing a negligible low-k interfacial layer. Moreover, a rutile TiO film with a high dielectric constant of 136 was successfully grown on a 20% Sn-TMO electrode. Overall, this study provides a strategy to stabilize metastable MoO films using ALD, and it demonstrates the superiority of ALD TMO as a promising DRAM capacitor electrode material.

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http://dx.doi.org/10.1021/acsami.4c03158DOI Listing

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Article Synopsis
  • DRAM capacitor electrodes like TiN have performance issues due to low work functions and unstable interfacial layers, prompting the search for better materials.
  • Molybdenum dioxide (MoO) has emerged as a superior alternative, boasting increased resistivity, a high work function, and good chemical stability, plus it allows for low-temperature growth of high-k rutile TiO.
  • The study successfully created Sn-doped MoO films using atomic layer deposition (ALD) at 300 °C, achieving a stabilized form of MoO with excellent interface quality and high dielectric properties, showcasing its potential for use in DRAM capacitors.
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