The reliability and scalability of Linear Wireless Sensor Networks (LWSNs) are limited by the high packet loss probabilities (PLP) experienced by the packets generated at nodes far from the sink node. This is an important limitation in Smart City applications, where timely data collection is critical for decision making. Unfortunately, previous works have not addressed this problem and have only focused on improving the network's overall performance. In this work, we propose a Distance-Based Queuing (DBQ) scheme that can be incorporated into MAC protocols for LWSNs to improve reliability and scalability without requiring extra local processing or additional signaling at the nodes. The DBQ scheme prioritizes the transmission of relay packets based on their hop distance to the sink node, ensuring that all packets experience the same PLP. To evaluate the effectiveness of our proposal, we developed an analytical model and conducted extensive discrete-event simulations. Our numerical results demonstrate that the DBQ scheme significantly improves the reliability and scalability of the network by achieving the same average PLP and throughput for all nodes, regardless of traffic intensities and network sizes.
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http://dx.doi.org/10.3390/s24072023 | DOI Listing |
Bioelectrochemistry
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Tongzhou Maternal & Child Health Hospital of Beijing, No. 124, Yuqiao Middle Road, Tongzhou District, Beijing 101101 PR China. Electronic address:
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View Article and Find Full Text PDFPLoS One
January 2025
Department of Respiratory and Critical Care Medicine, The First Medical Centre of Chinese PLA General Hospital, Haidian District, Beijing, China.
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View Article and Find Full Text PDFNPJ Digit Med
January 2025
Faculty of Health Sciences & Sport, University of Stirling, Stirling, UK.
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View Article and Find Full Text PDFACS Nano
January 2025
School of Physics and Astronomy, Monash University, Clayton, Victoria 3800, Australia.
Van der Waals electrode integration is a promising strategy to create nearly perfect interfaces between metals and 2D materials, with advantages such as eliminating Fermi-level pinning and reducing contact resistance. However, the lack of a simple, generalizable pick-and-place transfer technology has greatly hampered the wide use of this technique. We demonstrate the pick-and-place transfer of prefabricated electrodes from reusable polished hydrogenated diamond substrates without the use of any sacrificial layers due to the inherent low-energy and dangling-bond-free nature of the hydrogenated diamond surface.
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