Process Parameter Optimization for CO Laser Polishing of Fused Silica Using the Taguchi Method.

Fused silica was polished to a high quality by a CO laser beam with a rapid scanning rate. The rapid scanning rate produced a line laser heat source, resulting in a "polishing line" during the polishing process. The Taguchi method was used to evaluate the comprehensive influence of polishing process parameters on the polishing qualities. Four factors, namely the length of laser reciprocating scanning (A), laser beam scanning speed (B), feed speed (C), and defocusing amount (D), were investigated in this study. The optimal process parameter combination (A1B1C1D1) was obtained. The surface roughness of fused silica was reduced from Ra = 0.157 μm to 0.005 μm. Through analysis of variance (ANOVA), it was found that laser beam scanning speed (B) had a significant influence on the polishing quality. The interaction of the two factors plays a decisive role in the determination of the best process parameters, and the influence of other multi-factor interaction can be ignored; the interaction between A × B is the largest, with a contribution of 42.69%.