Enhancing Stability and Performance in Tin-Based Perovskite Field-Effect Transistors Through Hydrogen Bond Suppression of Organic Cation Migration.

Adv Mater

Key Laboratory of Automobile Materials of Ministry of Education, School of Materials Science and Engineering, Jilin University, Changchun, 130012, P. R. China.

Published: June 2024

AI Article Synopsis

  • Ion migration negatively impacts the performance and stability of tin-based perovskite field-effect transistors (FETs), particularly affecting hysteresis.
  • The study identifies that both Sn oxidation and FA ion migration contribute to a high background carrier density in FASnI FETs, but hydrogen bonding can help reduce this issue.
  • By adding 4-fluorophenethylammonium iodide, the research shows improved device performance, resulting in a significant decrease in voltage shifts and achieving effective mobility of 30 cm V s with a high I ratio.

Article Abstract

Ion migration poses a substantial challenge in perovskite transistors, exerting detrimental effects on hysteresis and operational stability. This study focuses on elucidating the influence of ion migration on the performance of tin-based perovskite field-effect transistors (FETs). It is revealed that the high background carrier density in FASnI FETs arises not only from the oxidation of Sn but also from the migration of FA ions. The formation of hydrogen bonding between FA and F ions efficiently inhibits ion migration, leading to a reduction in background carrier density and an improvement in the operational stability of the transistors. The strategy of hydrogen bond is extended to fluorine-substituted additives to improve device performance. The incorporation of 4-fluorophenethylammonium iodide additives into FETs significantly minimizes the shift of turn-on voltage during cyclic measurements. Notably, an effective mobility of up to 30 cm V s with an I ratio of 10 is achieved. These findings hold promising potential for advancing tin-based perovskite technology in the field of electronics.

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Source
http://dx.doi.org/10.1002/adma.202313461DOI Listing

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