Carbon nanotubes (CNTs), due to excellent electronic properties, are emerging as a promising semiconductor for diverse electronic applications with superiority over silicon. However, until now, the supposed superiority of CNTs by "head-to-head" comparison within a well-defined voltage range remains unrealized. Here, we report aligned CNT (ACNT)-based electronics on a glass wafer and successfully develop a 250-nm gate length ACNT-based field-effect transistor (FET) with an almost identical transfer curve to a "90-nm" node silicon device, indicating a three- to four-generation superiority. Moreover, a record gate delay of 9.86 ps is achieved by our ring oscillator, which exceeds silicon even at a lower supply voltage. Furthermore, the fabrication of basic logic gates indicates the potential for further digital integrated circuits. All of these results highlight ACNT-based FETs on the glass wafer as an effective solution/platform for further development of CNT-based electronics.
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http://dx.doi.org/10.1126/sciadv.adl1636 | DOI Listing |
Micromachines (Basel)
January 2025
Department of Semiconductor System Engineering, Sejong University, Seoul 05006, Republic of Korea.
In this article, resonance phenomena of high-speed interconnects and power delivery networks in glass packages are measured and analyzed. The resonances are generated in the interconnection by the physical dimension, cancelation of reactance components, and modes. When the resonances are generated in the operation frequency band, the signal/power integrity of the interconnect can be affected.
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December 2024
Zhejiang Xinsheng Semiconductor Technology, Zhuji 311899, China.
Silicon-glass anode bonding is the key technology in the process of wafer-level packaging for MEMS sensors. During the anodic bonding process, the device may experience adhesion failure due to the influence of electric field forces. A common solution is to add a metal shielding layer between the glass substrate and the device.
View Article and Find Full Text PDFMicromachines (Basel)
December 2024
Department of Foundry Engineering, Dankook University, Yongin 16890, Republic of Korea.
This paper presents a novel approach to fabricate substrate integrated waveguides (SIWs) on glass substrates with tin (Sn) through glass vias (TGVs) tailored for millimeter-wave applications. The fabrication process employs a custom-designed vacuum suctioning system to rapidly fill precise TGV holes in the glass substrate, which are formed by wafer-level glass reflow micromachining techniques with molten tin in a minute. This method offers a very fast and cost-effective alternative for complete via filling without voids compared to the conventional metallization techniques such as electroplating or sputtering.
View Article and Find Full Text PDFLight Sci Appl
January 2025
Institute for Photon Science and Technology, The University of Tokyo, Tokyo, Japan.
Light manipulation and control are essential in various contemporary technologies, and as these technologies evolve, the demand for miniaturized optical components increases. Planar-lens technologies, such as metasurfaces and diffractive optical elements, have gained attention in recent years for their potential to dramatically reduce the thickness of traditional refractive optical systems. However, their fabrication, particularly for visible wavelengths, involves complex and costly processes, such as high-resolution lithography and dry-etching, which has limited their availability.
View Article and Find Full Text PDFBiosens Bioelectron
March 2025
Department of Food Safety/Hygiene and Risk Management, College of Medicine, National Cheng Kung University, Tainan, 701, Taiwan; Institute of Basic Medical Sciences, College of Medicine, National Cheng Kung University, Tainan, 701, Taiwan. Electronic address:
Proteome microarray technology enables high-throughput analysis of protein interactions with all kinds of molecules. Wafer (6-inch) substrates offer a promising alternative to conventional glass (2.6 × 7.
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