AI Article Synopsis
- * Researchers developed a covalent lamination method using molybdenum disulfide (MoS) and a polymer called polydimethylsiloxane (PDMS), achieving strong and uniform adhesion and enabling a predicted band structure change in MoS under tension.
- * The new lamination method maintains the structural and electrical integrity of vdWS devices through extensive mechanical testing, enhancing their reliability for applications in biomedical fields and consumer electronics.
Article Abstract
Van der Waals semiconductors (vdWS) offer superior mechanical and electrical properties and are promising for flexible microelectronics when combined with polymer substrates. However, the self-passivated vdWS surfaces and their weak adhesion to polymers tend to cause interfacial sliding and wrinkling, and thus, are still challenging the reliability of vdWS-based flexible devices. Here, an effective covalent vdWS-polymer lamination method with high stretch tolerance and excellent electronic performance is reported. Using molybdenum disulfide (MoS )and polydimethylsiloxane (PDMS) as a case study, gold-chalcogen bonding and mercapto silane bridges are leveraged. The resulting composite structures exhibit more uniform and stronger interfacial adhesion. This enhanced coupling also enables the observation of a theoretically predicted tension-induced band structure transition in MoS . Moreover, no obvious degradation in the devices' structural and electrical properties is identified after numerous mechanical cycle tests. This high-quality lamination enhances the reliability of vdWS-based flexible microelectronics, accelerating their practical applications in biomedical research and consumer electronics.
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| http://dx.doi.org/10.1002/smll.202310175 | DOI Listing |
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