In Situ Formation of Hydrogel Wound Dressing Based on Carboxymethyl Chitin/Tannic Acid for Promoting Skin Wound Healing.

ACS Omega

Key Laboratory of Design and Assembly of Functional Nanostructures, Fujian Institute of Research on the Structure of Matter, Chinese Academy of Sciences, Fuzhou 350002, P. R. China.

Published: January 2024

Triggering the healing process of drug-resistant bacteria-infected wounds has attracted great attention due to global morbidity that may induce gangrene, amputation, and even death. Here, a chitin derivative, carboxymethyl chitosan (CMC), tannic acid (TA), and Cu were used for hydrogel engineering. Using sodium bicarbonate as the neutralizer and reductant, hydrogen bonds between CMC and TA and in situ Cu(OH) generation via ion coordination force between Cu and TA facilitated the synthesis of CMC/TA/Cu hydrogel. Cu and TA release, cytotoxicity, in vitro cell migration, angiogenesis, and antidrug-resistant bacteria were measured. Besides, wound closure was evaluated in vivo using the methicillin-resistant (MRSA)-infected excisional dermal wound mouse model. Negligible toxicity was observed both in vitro and in vivo. Dermal cell migration and angiogenesis were significantly enhanced. In vivo, the CMC/TA/Cu hydrogel induced effective re-epithelialization, collagen deposition, inflammatory alleviation, and MRSA inhibition during wound repair in mice. All these results confirmed that the CMC/TA/Cu hydrogel is a promising novel dressing for chronic wound healing in clinic.

Download full-text PDF

Source
http://www.ncbi.nlm.nih.gov/pmc/articles/PMC10831824PMC
http://dx.doi.org/10.1021/acsomega.3c06683DOI Listing

Publication Analysis

Top Keywords

cmc/ta/cu hydrogel
12
wound healing
8
cell migration
8
migration angiogenesis
8
wound
6
hydrogel
5
situ formation
4
formation hydrogel
4
hydrogel wound
4
wound dressing
4

Similar Publications

Want AI Summaries of new PubMed Abstracts delivered to your In-box?

Enter search terms and have AI summaries delivered each week - change queries or unsubscribe any time!