AI Article Synopsis

  • - The study explores using ferroelectric polarization to control band alignment in van der Waals heterostructures (vdWHs), specifically focusing on configurations made with α-InSe and MoTe materials.
  • - First-principles calculations reveal that these structures can switch between high and low conductance states based on the polarization direction, which is vital for creating new types of ferroelectric tunnel junctions (FTJs).
  • - The research indicates that increasing the thickness of the ferroelectric layer can enhance the tunneling electroresistance ratio significantly, positioning these vdWHs as promising candidates for high-performance FTJs and advanced non-volatile memory applications.

Article Abstract

Ferroelectric polarization-controlled band alignment can be realized in van der Waals heterostructures (vdWHs), which can be used to create new types of ferroelectric tunnel junctions (FTJs). In this work, we design six probable configurations of two-dimensional vdWHs based on a two-dimensional α-InSe ferroelectric material which has two opposite polarization states P↑ and P↓, and the semiconductor MoTe. First-principles calculations show robust ferroelectric polarization-controlled switching behavior between the high conductance state in configuration AA-P↓ and the low conductance state in configuration AA-P↑ in the most stable AA stacked vdWHs. Based on this vdWH, a two-dimensional transverse FTJ with AA-P↓ or AA-P↑ as the tunneling barrier and (InSn)Se monolayers (-type doped) as electrodes is designed. The tunneling electroresistance ratio of the FTJs at the Fermi level reaches 1.22 × 10% when the tunneling barrier contains two repeating units = 2 and can be greatly increased by increasing the thickness of the ferroelectric layer. Analysis of the work function, charge redistribution, and local density of states is performed to interpret the above phenomena. The findings suggest the great potential of the AA stacked α-InSe/MoTe vdWH in the design of high-performance FTJs and application in high-density non-volatile memory devices.

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Source
http://dx.doi.org/10.1039/d3cp04855aDOI Listing

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