AI Article Synopsis

  • Assembling van der Waals materials into thin films for electronics shows potential, especially at low temperatures, but previous attempts failed due to a lack of suitable dielectric materials and high-temperature processes.
  • The study introduces all-solution-processed thin-film transistors (TFTs) using molybdenum disulfide (MoS) as the channel and Dion-Jacobson perovskite oxides as the dielectric, with fabrication done below 250 °C.
  • The resulting MoS TFTs demonstrate impressive performance with high mobility, a significant on/off ratio, and allow for low-voltage operation and reduced power consumption, highlighting a scalable method for advanced electronics.

Article Abstract

Assembling solution-processed van der Waals () materials into thin films holds great promise for constructing large-scale, high-performance thin-film electronics, especially at low temperatures. While transition metal dichalcogenide thin films assembled in solution have shown potential as channel materials, fully solution-processed electronics have not been achieved due to the absence of suitable dielectric materials and high-temperature processing. In this work, we report on all-solution-processed thin-film transistors (TFTs) comprising molybdenum disulfides (MoS) as the channel and Dion-Jacobson-phase perovskite oxides as the high-permittivity dielectric. The constituent layers are prepared as colloidal solutions through electrochemical exfoliation of bulk crystals, followed by sequential assembly into a semiconductor/dielectric heterostructure for TFT construction. Notably, all fabrication processes are carried out at temperatures below 250 °C. The fabricated MoS TFTs exhibit excellent device characteristics, including high mobility (>10 cm V s) and an on/off ratio exceeding 10. Additionally, the use of a high- dielectric allows for operation at low voltage (∼5 V) and leakage current (∼10 A), enabling low power consumption. Our demonstration of the low-temperature fabrication of high-performance TFTs presents a cost-effective and scalable approach for heterointegrated thin-film electronics.

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Source
http://dx.doi.org/10.1021/acsnano.3c06972DOI Listing

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