A novel 9,9'-spirobifluorene derivative bearing thermally cross-linkable vinyl groups () was developed as a hole-transporting material for perovskite solar cells (PSCs). After thermal cross-linking, a smooth and solvent-resistant three-dimensional (3D) polymeric network is formed such that orthogonal solvents are no longer needed to process subsequent layers. Copolymerizing with 4,4'-thiobisbenzenethiol (dithiol) lowers the cross-linking temperature to 103 °C via the facile thiol-ene "click" reaction. The effectiveness of the cross-linked /dithiol was demonstrated both as a hole-transporting material in p-i-n and as an interlayer between the perovskite and the hole-transporting layer in n-i-p PSC devices. Both devices exhibit better power conversion efficiencies and operational stability than devices using conventional or hole-transporting materials.

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http://www.ncbi.nlm.nih.gov/pmc/articles/PMC10788832PMC
http://dx.doi.org/10.1021/acsami.3c13950DOI Listing

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