Severity: Warning
Message: file_get_contents(https://...@pubfacts.com&api_key=b8daa3ad693db53b1410957c26c9a51b4908&a=1): Failed to open stream: HTTP request failed! HTTP/1.1 429 Too Many Requests
Filename: helpers/my_audit_helper.php
Line Number: 176
Backtrace:
File: /var/www/html/application/helpers/my_audit_helper.php
Line: 176
Function: file_get_contents
File: /var/www/html/application/helpers/my_audit_helper.php
Line: 250
Function: simplexml_load_file_from_url
File: /var/www/html/application/helpers/my_audit_helper.php
Line: 3122
Function: getPubMedXML
File: /var/www/html/application/controllers/Detail.php
Line: 575
Function: pubMedSearch_Global
File: /var/www/html/application/controllers/Detail.php
Line: 489
Function: pubMedGetRelatedKeyword
File: /var/www/html/index.php
Line: 316
Function: require_once
Triboelectric materials present great potential for harvesting huge amounts of dispersed energy, and converting them directly into useful electricity, a process that generates power more sustainably. Triboelectric nanogenerators (TENGs) have emerged as a technology to power electronics and sensors, and it is expected to solve the problem of energy harvesting and self-powered sensing from extreme environments. In this paper, a high-temperature-resistant triboelectric material is designed based on multilevel non-covalent bonding interactions, which achieves an ultra-high surface charge density of 192 µC m at high temperatures. TENGs based on the triboelectric material exhibit more than an order of magnitude higher power output (2750 mW m at 200 °C) than the existing devices at high temperatures. These remarkable properties are achieved based on enthalpy-driven molecular assembly in highly unbonded states. Thus, the material maintains bond strength and ultra-high surface charge density in entropy-dominated high-temperature environments. This molecular design concept points out a promising direction for the preparation of polymers with excellent triboelectric properties.
Download full-text PDF |
Source |
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http://dx.doi.org/10.1002/smll.202307504 | DOI Listing |
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