Two-dimensional (2D) semiconductors with bizarre properties show great application potential for nanoscale devices, which is regarded as the Si alternation to extend the Moore's Law in sub-5 nm era. In this study, we investigate the electronic structure and ballistic transport characteristics of sub-5 nm bilayer (BL) GaOmetal-oxide-semiconductor field-effect transistor (MOSFET) using the first-principles calculations and the nonequilibrium Green's function method. Quasi-direct band structure with bandgap of 4.77 eV is observed in BL GaO, and high electron mobility of 910 cmVsat 300 K is observed under the full-phonon scattered processes. Due to the enlarged natural length, the gate-controllable ability of 2D GaOn-MOSFET is suppressed with the increased layer. The transport characteristic investigation indicates that BL GaOn-MOSFETs can meet the latest International Technology Roadmap for Semiconductors requirement for high-performance application until= 4 nm. The figures of merits including on-current, intrinsic delay time, and power delay product are showing competitive potential with the reported 2D materials. With the help of underlap structure, the device performance can be further improved in the sub-3 nm region. Our results indicate that BL GaOis a promising candidate for sub-5 nm MOSFET applications.
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http://dx.doi.org/10.1088/1361-648X/ad00f5 | DOI Listing |
Mater Horiz
December 2024
School of Electronic and Computer Engineering, Peking University, Shenzhen 518055, China.
The decoupling of electronic states between metals and semiconductors through controlled construction of artificial van der Waals (vdW) heterojunctions enables tailored Schottky barriers. However, the interfacial chemistry, especially involving solid-liquid interfaces, remains unexplored. Here, first principles calculations reveal unexpected strong Fermi-level pinning in various metal/MoS vdW heterojunctions with intercalated ice-like water bilayers.
View Article and Find Full Text PDFJ Phys Condens Matter
October 2023
Shaanxi Province Key Laboratory of Thin Films Technology and Optical Test, Xi'an Technological University, Xi'an 710032, People's Republic of China.
Two-dimensional (2D) semiconductors with bizarre properties show great application potential for nanoscale devices, which is regarded as the Si alternation to extend the Moore's Law in sub-5 nm era. In this study, we investigate the electronic structure and ballistic transport characteristics of sub-5 nm bilayer (BL) GaOmetal-oxide-semiconductor field-effect transistor (MOSFET) using the first-principles calculations and the nonequilibrium Green's function method. Quasi-direct band structure with bandgap of 4.
View Article and Find Full Text PDFAdv Mater
November 2021
Shanghai Key Lab of Advanced High-Temperature Materials and Precision Forming, State Key Laboratory of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai, 200240, China.
Solid-state batteries (SSBs) are considered as the most promising next-generation high-energy-density energy storage devices due to their ability in addressing the safety concerns from organic electrolytes and enabling energy dense lithium anodes. To ensure the high energy density of SSBs, solid-state electrolytes (SSEs) are required to be thin and light-weight, and simultaneously offer a wide electrochemical window to pair with high-voltage cathodes. However, the decrease of SSE thickness and delicate structure may increase the cell safety risks, which is detrimental for the practical application of SSBs.
View Article and Find Full Text PDFSmall
November 2019
School of Materials Science, Japan Advanced Institute of Science and Technology, 1-1 Asahidai, Nomi, Ishikawa, 923-1292, Japan.
The predicted quasiparticle energy gap of more than 1 eV in sub-6 nm graphene nanoribbons (GNRs) is elusive, as it is strongly suppressed by the substrate dielectric screening. The number of techniques that can produce suspended high-quality and electrically contacted GNRs is small. The helium ion beam milling technique is capable of achieving sub-5 nm patterning; however, the functional device fabrication and the electrical characteristics are not yet reported.
View Article and Find Full Text PDFAdv Mater
July 2019
School of Electrical and Computer Engineering, and Birck Nanotechnology Center, Purdue University, West Lafayette, IN, 47907, USA.
The interconnect half-pitch size will reach ≈20 nm in the coming sub-5 nm technology node. Meanwhile, the TaN/Ta (barrier/liner) bilayer stack has to be >4 nm to ensure acceptable liner and diffusion barrier properties. Since TaN/Ta occupy a significant portion of the interconnect cross-section and they are much more resistive than Cu, the effective conductance of an ultrascaled interconnect will be compromised by the thick bilayer.
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