Large-scale and stacked transfer of bilayers MoSdevices on a flexible polyimide substrate.

Two-dimensional transition metal dichalcogenides (TMDs), as flexible and stretchable materials, have attracted considerable attention in the field of novel flexible electronics due to their excellent mechanical, optical, and electronic properties. Among the various TMD materials, atomically thin MoShas become the most widely used material due to its advantageous properties, such as its adjustable bandgap, excellent performance, and ease of preparation. In this work, we demonstrated the practicality of a stacked wafer-scale two-layer MoSfilm obtained by transferring multiple single-layer films grown using chemical vapor deposition. The MoSfield-effect transistor cell had a top-gated device structure with a (PI) film as the substrate, which exhibited a high on/off ratio (10), large average mobility (∼8.56 cmVs), and exceptional uniformity. Furthermore, a range of flexible integrated logic devices, including inverters, NOR gates, and NAND gates, were successfully implemented via traditional lithography. These results highlight the immense potential of TMD materials, particularly MoS, in enabling advanced flexible electronic and optoelectronic devices, which pave the way for transformative applications in future-generation electronics.