Coefficient Extraction of SAC305 Solder Constitutive Equations Using Equation-Informed Neural Networks.

Materials (Basel)

Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu City 30013, Taiwan.

Published: July 2023

Equation-Informed Neural Networks (EINNs) are developed as an efficient method for extracting the coefficients of constitutive equations. Subsequently, numerical Bayesian Inference (BI) iterations were applied to estimate the distribution of these coefficients, thereby further refining them. We could generate coefficients optimally aligned with the targeted application scenario by carefully adjusting pre-processing mapping parameters and identifying dataset preferences. Leveraging graphical representation techniques, the EINNs formulation is implemented in temperature- and strain-rate-dependent hyperbolic Garofalo, Anand, and Chaboche constitutive models to extract the corresponding coefficients for lead-free SAC305 solder material. The performance of the EINNs-based extracted coefficients, obtained from experimental results of SAC305 solder material, is comparable to existing studies. The methodology offers the dual advantage of providing the coefficients' value and distribution against the training dataset.

Download full-text PDF

Source
http://www.ncbi.nlm.nih.gov/pmc/articles/PMC10381129PMC
http://dx.doi.org/10.3390/ma16144922DOI Listing

Publication Analysis

Top Keywords

sac305 solder
12
constitutive equations
8
equation-informed neural
8
neural networks
8
solder material
8
coefficients
5
coefficient extraction
4
extraction sac305
4
solder constitutive
4
equations equation-informed
4

Similar Publications

Low-melting metal alloys have gained renewed attention for additive manufacturing, energy storage and microelectronics. However, micro- and nanostructure characterisation demands highly sophisticated sample preparation. Here, we optimise the Ga-FIB preparation of atom probe tomography (APT) specimens for low melting SAC305 solder materials utilising different FESEM/FIB stage temperatures.

View Article and Find Full Text PDF

Cu Pillar Electroplating Using a Synthetic Polyquaterntum Leveler and Its Coupling Effect on SAC305/Cu Solder Joint Voiding.

Materials (Basel)

November 2024

Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China.

With the advancement of high-integration and high-density interconnection in chip manufacturing and packaging, Cu bumping technology in wafer- and panel- level packaging is developed to micrometer-sized structures and pitches to accommodate increased I/O numbers on high-end integrated circuits. Driven by this industrial demand, significant efforts have been dedicated to Cu electroplating techniques for improved pillar shape control and solder joint reliability, which substantially depend on additive formulations and electroplating parameters that regulate the growth morphology, crystal structure, and impurity incorporation in the process of electrodeposition. It is necessary to investigate the effect of an additive on Cu pillar electrodeposition, and to explore the Kirkendall voids formed during the reflowing process, which may result from the additive-induced impurity in the electrodeposited Cu pillars.

View Article and Find Full Text PDF

Study on Thermal Cycling Reliability of Epoxy-Enhanced SAC305 Solder Joint.

Polymers (Basel)

September 2024

Joining and Welding Research Institute, Osaka University, Ibaraki 5670047, Japan.

Article Synopsis
  • Epoxy was added to commercial SAC305 solder paste to improve the thermal cycling reliability of solder joints, which is crucial for electronic packaging.
  • The study utilized SEM/EDS to examine the microstructure and performed shear tests, showing that the epoxy layer helps manage thermal stress and reduces structural defects during thermal cycling.
  • Results revealed that epoxy-enhanced joints had better shear performance and displayed a ductile fracture mode after 1000 cycles, indicating their potential for high-performance electronic applications.
View Article and Find Full Text PDF

In this study, we investigated the brittle fracture behavior of Sn-3.0Ag-0.5Cu (SAC305) solder joints with a Direct Electroless Gold (DEG) surface finish, formed using laser-assisted bonding (LAB) and mass reflow (MR) techniques.

View Article and Find Full Text PDF

Reliability Risk Mitigation in Advanced Packages by Aging-Induced Precipitation of Bi in Water-Quenched Sn-Ag-Cu-Bi Solder.

Materials (Basel)

July 2024

Department of Materials Science and Engineering, Advanced Materials Processing and Analysis Center, University of Central Florida, Orlando, FL 32816, USA.

Bi-doped Sn-Ag-Cu (SAC) microelectronic solder is gaining attention for its utility as a material for solder joints that connect substrates to printed circuit boards (PCB) in future advanced packages, as Bi-doped SAC is reported to have a lower melting temperature, higher strength, higher wettability on conducting pads, and lower intermetallic compound (IMC) formation at the solder-pad interface. As solder joints are subjected to aging during their service life, an investigation of aging-induced changes in the microstructure and mechanical properties of the solder alloy is needed before its wider acceptance in advanced packages. This study focuses on the effects of 1 to 3 wt.

View Article and Find Full Text PDF

Want AI Summaries of new PubMed Abstracts delivered to your In-box?

Enter search terms and have AI summaries delivered each week - change queries or unsubscribe any time!