Effect of nonthermal atmospheric plasma on bond strength of composite resin using total-etch and self-etch adhesive systems.

Aim: The aim of this study was to assess the impact of nonthermal atmospheric plasma (NTAP) on the bond strength of composite resin following plasma application at different steps of dentin bonding in total-etch and self-etch adhesive systems.

Materials And Methods: Ninety extracted third molars were taken, and the occlusal surfaces were removed until the exposure of the dentin. Samples were distributed into two main groups: Group T: total-etch adhesive system and Group S: self-etch adhesive system. Groups are further subdivided ( = 10) based on plasma application at different steps of dentin bonding. T1: surface etching with 37% phosphoric acid and bonding agent application. T2: plasma application and bonding agent application. T3: plasma application, etching, and bonding agent application. T4: etching, plasma application, and bonding agent application. T5: etching, plasma application, bonding agent application, and again plasma application. S1: self-etch bonding agent application. S2: plasma application and bonding agent application. S3: Bonding agent application and plasma application. S4: plasma application, bonding agent application, and again plasma application. For all the samples, composite resin buildup was done, and shear bond strength (SBS) was measured. The contact angle was measured at different steps of dental adhesive systems.

Statistical Analysis: Two-way analysis of variance and the post hoc Tukey's test were used for analysis, regarding < 0.05 as statistically significant.

Results: Among all groups of total-etch and self-etch adhesives, Group T4 (48.81 Mpa) and Group S2 (36.59 Mpa), respectively, have demonstrated significantly greater bond strength values than the corresponding control groups.

Conclusion: NTAP enhanced the composite resin's SBS when plasma treatment was done before bonding agent application and significantly reduced the contact angles of the distilled water.