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Multifunctional Hierarchical Metamaterial for Thermal Insulation and Electromagnetic Interference Shielding at Elevated Temperatures. | LitMetric

Multifunctional Hierarchical Metamaterial for Thermal Insulation and Electromagnetic Interference Shielding at Elevated Temperatures.

ACS Nano

State Key Laboratory of High Performance Ceramics & Superfine Microstructure, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 200050, China.

Published: July 2023

The custom design of lightweight cellular materials is widely concerned due to effectively improved mechanical properties and functional applications. However, the strength attenuation and brittleness behavior hinder honeycomb structure design for the ceramic monolith. Herein, the ceramic matrix composite metamaterial (CCM) with a negative Poisson's ratio and high specific strength, exhibiting superelasticity, stability, and high compressive strength, is customized by combining centripetal freeze-casting and hierarchical structures. CCM maintains a negative Poisson's ratio response under compression with the lowest value reaching -0.16, and the relationship between CCM's specific modulus and density is ∼ ρ, which indicates the mechanical metamaterial characteristic of high specific strength. In addition to the extraordinary mechanical performance endowed by hierarchical structures, the CCM exhibits excellent thermal insulation and electromagnetic interference shielding properties, in which the thermal conductivity is 30.62 mW·m·K and the electromagnetic interference (EMI) shielding efficiency (SE) reaches 40 dB at room temperature. The specific EMI shielding efficiency divided by thickness (SSE/) of CCM can reach 9416 dB·cm·g at 700 °C due to its stability at elevated temperatures, which is 100 times higher than that of traditional ceramic matrix composites. Moreover, the designed hierarchical structure and metamaterial properties provide a potential scheme to implement cellular materials with collaborative optimization in structure and function.

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Source
http://dx.doi.org/10.1021/acsnano.3c03332DOI Listing

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