Heterostructured materials afford a new way to improve the mechanical properties, which has become vital in both materials science and engineering applications. In the present research, Cu/Nb multilayer composites with layer thicknesses from the micrometer to nanometer were fabricated by accumulative roll bonding and the microstructure and mechanical properties of the Cu/Nb multilayer composites were then investigated. The yield strength and ultimate tensile strength of these composites increase with decreasing layer thickness. Moreover, the relationship between yield strength and (layer thickness) approximately accords with the conventional Hall-Petch equation but with a decrease in the Hall-Petch slope when the layer thickness decreases from the micrometer to nanometer scales. The deformation microstructure of these Cu/Nb multilayer composites clearly exhibit dislocations glide in the layers, which reduces the stacking of dislocations at the Cu-Nb interface and thereby weakens the strengthening effect of the interface.
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| http://dx.doi.org/10.1016/j.heliyon.2023.e16231 | DOI Listing |
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