Out-of-Plane Electronics on Flexible Substrates Using Inorganic Nanowires Grown on High-Aspect-Ratio Printed Gold Micropillars.

Adv Mater

Bendable Electronics and Sustainable Technologies (BEST) Group, Electrical and Computer Engineering Department, Northeastern University, Boston, MA, 02115, USA.

Published: June 2023

Out-of-plane or 3D electronics on flexible substrates are an interesting direction that can enable novel solutions such as efficient bioelectricity generation and artificial retina. However, the development of devices with such architectures is limited by the lack of suitable fabrication techniques. Additive manufacturing (AM) can but often fail to provide high-resolution, sub-micrometer 3D architectures. Herein, the optimization of a drop-on-demand (DoD), high-resolution electrohydrodynamic (EHD)-based jet printing method for generating 3D gold (Au) micropillars is reported. Libraries of Au micropillar electrode arrays (MEAs) reaching a maximum height of 196 µm and a maximum aspect ratio of 52 are printed. Further, by combining AM with the hydrothermal growth method, a seedless synthesis of zinc oxide (ZnO) nanowires (NWs) on the printed Au MEAs is demonstrated. The developed hybrid approach leads to hierarchical light-sensitive NW-connected networks exhibiting favorable ultraviolet (UV) sensing as demonstrated via fabricating flexible photodetectors (PDs). The 3D PDs exhibit an excellent omnidirectional light-absorption ability and thus, maintain high photocurrents over wide light incidence angles (±90°). Lastly, the PDs are tested under both concave and convex bending at 40 mm, showing excellent mechanical flexibility.

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Source
http://dx.doi.org/10.1002/adma.202210711DOI Listing

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