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Article Abstract

In this paper, we present an innovative manufacturing process for the production of capacitive pressure and force sensors with excellent thermal stability for high-temperature applications. The sensors, which are manufactured from a stack of two silicon chips mounted via with gold-silicon (Au-Si) or aluminum-silicon (Al-Si) eutectic bonding, are shielded, miniaturized, and allow an operating temperature of up to 500 °C. Compared to conventional methods, the greatest benefit of the manufacturing process is that different sensor dimensions can be produced in the same batch for a wide measuring range, from mN to kN. The characterization of the realized sensors shows a high linearity and a low temperature drift of 99.992% FS and -0.001% FS/K at 350 °C, as well as a nonlinearity of 0.035% FS and a temperature drift of -0.0027% FS/K at 500 °C.

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http://www.ncbi.nlm.nih.gov/pmc/articles/PMC10181345PMC
http://dx.doi.org/10.3390/s23094248DOI Listing

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