Severity: Warning
Message: file_get_contents(https://...@pubfacts.com&api_key=b8daa3ad693db53b1410957c26c9a51b4908&a=1): Failed to open stream: HTTP request failed! HTTP/1.1 429 Too Many Requests
Filename: helpers/my_audit_helper.php
Line Number: 176
Backtrace:
File: /var/www/html/application/helpers/my_audit_helper.php
Line: 176
Function: file_get_contents
File: /var/www/html/application/helpers/my_audit_helper.php
Line: 250
Function: simplexml_load_file_from_url
File: /var/www/html/application/helpers/my_audit_helper.php
Line: 3122
Function: getPubMedXML
File: /var/www/html/application/controllers/Detail.php
Line: 575
Function: pubMedSearch_Global
File: /var/www/html/application/controllers/Detail.php
Line: 489
Function: pubMedGetRelatedKeyword
File: /var/www/html/index.php
Line: 316
Function: require_once
An innovative processing to deposit P(VDF-TrFE) film on silicon wafers by an inkjet printing method was used to fabricate high-frequency annular array prototype. This prototype has a total aperture of 7.3 mm and 8 active elements. A polymer-based lens with low acoustic attenuation was added to the flat deposition on the wafer, setting the geometric focus to 13.8 mm. With a thickness of around 11 μm, the electromechanical performance of P(VDF-TrFE) films was evaluated with an effective thickness coupling factor of 22%. Electronics allowing all elements to simultaneously emit as a single element transducer was developed. In reception, a dynamic focusing, based on eight independent amplifying channels, was preferred. The center frequency of the prototype was 21.3 MHz, the insertion loss was 48.5 dB and the -6 dB fractional bandwidth was 143%. The trade-off sensitivity/bandwidth has rather favored the large bandwidth. Dynamic focusing on reception was applied and allowed to improvements in the lateral-full width at half maximum as shown on images obtained with a wire phantom at several depths. The next step, for a fully operational multi-element transducer, will be to achieve a significant increase of the acoustic attenuation in the silicon wafer.
Download full-text PDF |
Source |
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http://dx.doi.org/10.1109/TUFFC.2023.3242073 | DOI Listing |
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