AI Article Synopsis
- This study introduces a new low-temperature transient liquid phase bonding (TLPB) technique using Sn58Bi and porous Cu to improve power-device packaging for high-temperature applications.
- The bonding process relies on the rapid interaction between the porous Cu and Sn58Bi solder, creating intermetallic compounds that withstand high temperatures.
- The research examines how different bonding atmospheres, times, and external pressures affect the shear strength of the metal joints, with results showing that applying 10 MPa of pressure at 250 °C for 5 minutes yields a strong joint with a shear strength of 62.2 MPa.
Article Abstract
This study proposes a low-temperature transient liquid phase bonding (TLPB) method using Sn58Bi/porous Cu/Sn58Bi to enable efficient power-device packaging at high temperatures. The bonding mechanism is attributed to the rapid reaction between porous Cu and Sn58Bi solder, leading to the formation of intermetallic compounds with high melting point at low temperatures. The present paper investigates the effects of bonding atmosphere, bonding time, and external pressure on the shear strength of metal joints. Under formic acid (FA) atmosphere, CuSn forms at the porous Cu foil/Sn58Bi interface, and some of it transforms into CuSn. External pressure significantly reduces the micropores and thickness of the joint interconnection layer, resulting in a ductile fracture failure mode. The metal joint obtained under a pressure of 10 MPa at 250 °C for 5 min exhibits outstanding bonding mechanical performance with a shear strength of 62.2 MPa.
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Source |
|---|---|
| http://www.ncbi.nlm.nih.gov/pmc/articles/PMC10051379 | PMC |
| http://dx.doi.org/10.3390/ma16062389 | DOI Listing |
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