This paper describes the development of a coating for cotton and polypropylene (PP) fabrics based on a polymeric matrix embedded with cuprous oxide nanoparticles (CuO@SDS NPs) in order to inactivate SARS-CoV-2 and manufactured by a simple process using a dip-assisted layer-by-layer technology, at low curing temperature and without the need for expensive equipment, capable of achieving disinfection rates of up to 99%. The polymeric bilayer coating makes the surface of the fabrics hydrophilic, enabling the transportation of the virus-infected droplets to achieve the rapid inactivation of SARS-CoV-2 by contact with the CuO@SDS NPs incorporated in the coated fabrics.
Download full-text PDF |
Source |
|---|---|
| http://www.ncbi.nlm.nih.gov/pmc/articles/PMC9974211 | PMC |
| http://dx.doi.org/10.1016/j.ijpharm.2023.122790 | DOI Listing |
Publication Analysis
Top Keywords
Similar Publications
Biofabrication of copper oxide nanoparticles using Dalbergia sisso leaf extract for antibacterial, antibiofilm and antioxidant activities.
Sci Rep
December 2024
Plant Production Department, College of Food and Agricultural Sciences, King Saud University, P.O. Box. 2460, 11451, Riyadh, Saudi Arabia.
One of the biggest challenges encountered by the current generation is the evolution of antibiotic resistant bacteria as a result of excessive and inappropriate use of antibiotics. This problem has led to the development of alternative approaches to treat the diseases caused by these multidrug resistant bacteria (MDR). One of the most promising and novel approaches to combat these pathogens is utilization of nanomaterials as antimicrobial agents.
View Article and Find Full Text PDFInvestigation of functional characteristics of copper/copper oxide nanoparticles synthesized with Moringa oleifera and Musa sps. extracts: in-vitro and porcine study.
Sci Rep
December 2024
Department of Chemical Engineering, RVR & JC College of Engineering (A), Guntur, Andhra Pradesh, 522019, India.
The study analyzed the aqueous leaf extracts of Moringa oleifera and Musa sps. for phytochemical components, including flavonoids, sterols, saponins, tannins, and glycosides. The LC-MS analysis revealed gingerol, vicenin-2, caffeic acid, quercetin, and other compounds in the extracts.
View Article and Find Full Text PDFPoint-of-Care Detection of Carcinoembryonic Antigen (CEA) Using a Smartphone-Based, Label-Free Electrochemical Immunosensor with Multilayer CuONPs/CNTs/GO on a Disposable Screen-Printed Electrode.
Biosensors (Basel)
December 2024
Research Laboratory for Analytical Instrument and Electrochemistry Innovation, Department of Chemistry, Faculty of Science, Chiang Mai University, Chiang Mai 50200, Thailand.
In order to identify carcinoembryonic antigen (CEA) in serum samples, an innovative smartphone-based, label-free electrochemical immunosensor was created without the need for additional labels or markers. This technology presents a viable method for on-site cancer diagnostics. The novel smartphone-integrated, label-free immunosensing platform was constructed by nanostructured materials that utilize the layer-by-layer (LBL) assembly technique, allowing for meticulous control over the interface.
View Article and Find Full Text PDFSilicon Etching Using Copper-Metal-Assisted Chemical Etching: Unveiling the Role of CuO in Microscale Structure Fabrication.
ACS Appl Mater Interfaces
December 2024
Department of Materials Science and Engineering, Seoul National University, Seoul 08826, Republic of Korea.
Achieving precise and cost-effective etching in the field of silicon three-dimensional (3D) structure fabrication remains a significant challenge. Here, we present the successful fabrication of microscale anisotropic Si structures with an etching anisotropy of 0.73 using Cu-metal-assisted chemical etching (Cu-MACE) and propose a mechanism to elucidate the chemical behavior of Cu within the MACE solution.
View Article and Find Full Text PDFFundamental Insights into Copper-Epoxy Interfaces for High-Frequency Chip-to-Chip Interconnects.
ACS Appl Mater Interfaces
December 2024
Gordon A. and Mary Cain Department of Chemical Engineering, Louisiana State University, Baton Rouge, Louisiana 70803, United States.
Future processes and materials are needed to enable multichip packages with chip-to-chip (C2C) data rates of 50 GB/s or higher. This presents a fundamental challenge because of the skin effect, which exacerbates signal transmission losses at high frequencies. Our results indicate that smooth copper interconnects with relatively thin cuprous oxides (CuO, Cu) and amine-functional silane adhesion promoters improve interfacial adhesion with epoxy dielectrics by nearly an order of magnitude.
View Article and Find Full Text PDFWant AI Summaries of new PubMed Abstracts delivered to your In-box?
Enter search terms and have AI summaries delivered each week - change queries or unsubscribe any time!