In Situ Study of the Interface-Mediated Solid-State Reactions during Growth and Postgrowth Annealing of Pd/a-Ge Bilayers.

ACS Appl Mater Interfaces

Institut für Photonenforschung und Synchrotronstrahlung (IPS), Karlsruher Institut für Technologie, D-76021 Karlsruhe, Germany.

Published: March 2023

AI Article Synopsis

  • Ohmic and Schottky contacts in micro- and nanoelectronics rely on metal-semiconductor bilayer systems, specifically involving elemental metals and stable metallic compounds like germanides and silicides, yet controlling their electronic properties remains complex due to unclear structural formation processes.
  • Researchers conducted a study on Pd/a-Ge bilayers with various Pd/Ge ratios, employing real-time synchrotron X-ray techniques to track microstructure changes during deposition and annealing, revealing that Pd(111) grows coherently on polycrystalline PdGe[111] with notable resistivity changes during thin film formation.
  • The study established connections between phase formation and microstructure during deposition and the solid-state reaction during annealing, showing that the

Article Abstract

Ohmic or Schottky contacts in micro- and nanoelectronic devices are formed by metal-semiconductor bilayer systems, based on elemental metals or thermally more stable metallic compounds (germanides, silicides). The control of their electronic properties remains challenging as their structure formation is not yet fully understood. We have studied the phase and microstructure evolution during sputter deposition and postgrowth annealing of Pd/a-Ge bilayer systems with different Pd/Ge ratios (Pd:Ge, 2Pd:Ge, and 4Pd:Ge). The room-temperature deposition of up to 30 nm Pd was monitored by simultaneous, in situ synchrotron X-ray diffraction, X-ray reflectivity, and optical stress measurements. With this portfolio of complementary real-time methods, we could identify the microstructural origins of the resistivity evolution during contact formation: Real-time X-ray diffraction measurements indicate a coherent, epitaxial growth of Pd(111) on the individual crystallites of the initially forming, polycrystalline PdGe[111] layer. The crystallization of the PdGe interfacial layer causes a characteristic change in the real-time wafer curvature (tensile peak), and a significant drop of the resistivity after 1.5 nm Pd deposition. In addition, we could confirm the isostructural interface formation of Pd/a-Ge and Pd/a-Si. Subtle differences between both interfaces originate from the lattice mismatch at the interface between compound and metal. The solid-state reaction during subsequent annealing was studied by real-time X-ray diffraction and complementary UHV surface analysis. We could establish the link between phase and microstructure formation during deposition and annealing-induced solid-state reaction: The thermally induced reaction between Pd and a-Ge proceeds via diffusion-controlled growth of the PdGe seed crystallites. The second-phase (PdGe) formation is nucleation-controlled and takes place only when a sufficient Ge reservoir exists. The real-time access to structure and electronic properties on the nanoscale opens new paths for the knowledge-based formation of ultrathin metal/semiconductor contacts.

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Source
http://www.ncbi.nlm.nih.gov/pmc/articles/PMC9983571PMC
http://dx.doi.org/10.1021/acsami.2c20600DOI Listing

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